Stepan Lucyszyn

Stepan Lucyszyn PhD, DSc, FIEEE, is Professor of Millimetre-wave Systems at Imperial College London.

For a brief time, Lucyszyn worked in industry, as a satellite systems engineer for maritime and military communications. In 1994, he registered with the Engineering Council as a qualified chartered engineer.

Lucyszyn spent 12 years researching microwave and (sub-)millimetre-wave RFICs/MMICs. He co-edited a book entitled RFIC and MMIC Design and Technology, published by the Institution of Electrical Engineers (IEE, now the IET) in 2001. This book was translated into Chinese in 2007. For his contributions to RFICs/MMICs, he was made an adjunct professor at the University of Electronic Science and Technology of China (Chengdu, China) in 2008.

In 2001, Lucyszyn started working on RF MEMS. In 2004, he published a review paper on RF MEMS technology, which won an IEE Premium Award in 2005. He edited the book entitled Advanced RF MEMS, published by Cambridge University Press in 2010. For his contributions to RF MEMS, he was made a guest professor at Tsinghua University (Beijing, China) in 2008.

Lucyszyn first starting working on millimetre-wave and terahertz technologies in 1992 and 1996, respectively. In 2010, he was awarded the DSc degree (higher doctorate) of Imperial College London for his contributions to Millimetre-wave and Terahertz Electronics. In 2011, he introduced the concept and has since been pioneering "over the THz horizon" thermal infrared 'THz Torch' technologies. In 2012, he co-founded the cross-disciplinary Centre for Terahertz Science and Engineering at Imperial College London and was co-director until 2019.

In recent years, Lucyszyn has concentrated his research activities on 3D printing for microwave, millimetre-wave and terahertz applications. For his contributions to passive component technologies, he was made a visiting professor at Tohoku University (Sendai, Japan) in 2019. In 2022, for their work on 3D printing, Lucyszyn and his team at Imperial College London won Junkosha's inaugural Technology Innovator of the Year Award for the Microwave and Millimeter Wave category.

Lucyszyn has (co-)authored well over 200 papers and 12 book chapters in applied physics and engineering. He served as Editor-in-Chief for the International Journal of Electronics (2002-2006) and Associate Editor for the Journal of Microelectromechanical Systems (2005-2009). In 2011, Lucyszyn chaired the 41st European Microwave Conference (EuMC).

Lucyszyn was an External Examiner at the University of Leeds (2009-2013) and University College Cork (2017-2021) for their undergraduate degree programmes in Electrical and Electronic Engineering. Lucyszyn was made an IEEE Distinguished Microwave Lecturer (DML) (2010-1012) and a EuMA European Microwave Lecturer (EML) (2013).

He was made a Fellow of the Institute of Physics (UK, 2005), Fellow of the Institution of Electrical Engineers (UK, 2005) and Fellow of The Electromagnetics Academy (USA, 2008). Lucyszyn was elevated to Fellow of the Institute of Electrical and Electronics Engineers (USA, 2014) 'for contributions to monolithic microwave integrated circuits and radio frequency microelectromechanical systems'.

In 2004, Lucyszyn was interviewed on the TV programme 'Click Online', by BBC reporter Spencer Kelly, for his views on fire risks associated with mobile phones. In 2013, Lucyszyn was selected to take part in the Royal Society Pairing Scheme's ‘Week in Westminster’, where he was partnered with the Head of Chief Scientific Advisers (CSAs) Partnership Team at the Government Office for Science (GO-Science). In 2014, Lucyszyn travelled to a minefield in Croatia with legendary Manchester United and England footballer Sir Bobby Charlton (founder of the Find A Better Way (FABW) charity) to investigate new technologies for landmine detection.

In 2014, with Lord (Paul Rudd) Drayson, he co-founded the Imperial College London spin-out company Drayson Wireless Ltd. (renamed 'Drayson Technologies Ltd' in 2015), being a co-inventor in two patent families associated with radiative and inductive wireless power transfer.

Selected Publications

Journal Articles

• Zhu L, Rossuck I, Payapulli R, et al., 2023, 3-D printed W-band waveguide twist with integrated filtering, Ieee Microwave and Wireless Technology Letters, Vol:33, ISSN:2771-957X, Pages:659-662
• Payapulli R, Zhu L, Shin S-H, et al., 2023, Polymer-based 3-D printed 140 to 220 GHz metal waveguide thru lines, twist and filters, Ieee Access, Vol:11, ISSN:2169-3536, Pages:32272-32295
• Zhu L, Shin S-H, Payapulli R, et al., 2023, 3-D printed rectangular waveguide 123-129 GHz packaging for commercial CMOS RFICs, Ieee Microwave and Wireless Technology Letters, Vol:33, ISSN:2771-957X, Pages:157-160
• Shin S-H, Payapulli R, Zhu L, et al., 2022, 3-D Printed Plug and Play Prototyping for Low-cost Sub-THz Subsystems, Ieee Access, Vol:10, ISSN:2169-3536, Pages:41708-41719
• Zhu L, Payapulli R, Shin S-H, et al., 2022, 3-D printing quantization predistortion applied to sub-THz chained-function filters, Ieee Access, Vol:10, ISSN:2169-3536, Pages:38944-38963
• Dawood A, Lucyszyn S, 2021, Parasitic high Q-factor open-box modes with 3-D printed dielectric-filled metal waveguides, Ieee Access, Vol:9, ISSN:2169-3536, Pages:134319-134334
• Marquez-Segura E, Shin S-H, Dawood A, et al., 2021, Microwave characterization of conductive PLA and its application to a 12 to 18 GHz 3-D printed rotary vane attenuator, Ieee Access, Vol:9, ISSN:2169-3536, Pages:84327-84343
• Shin S, Shang X, Ridler N, et al., 2021, Polymer-based 3-D printed 140-220 GHz low-cost quasi-optical components and integrated subsystem assembly, Ieee Access, Vol:9, ISSN:2169-3536, Pages:28020-28038
• Ren H, Shin S, Lucyszyn S, 2020, Enhanced cognitive demodulation with artificial intelligence, Scientific Reports, Vol:10, ISSN:2045-2322, Pages:1-16
• Jones A, Lucyszyn S, Marquez-Segura E, et al., 2020, 3-D printed standards for calibration of microwave network analysers, Measurement, Vol:158, ISSN:0263-2241, Pages:1-10
• Ren H, Lucyszyn S, 2020, Thermodynamics-based cognitive demodulation for THz Torch' wireless communications links, Scientific Reports, Vol:10, ISSN:2045-2322
• Shin S-H, Lucyszyn S, 2020, Benchmarking a Commercial (Sub-)THz Focal Plane Array Against a Custom-Built Millimeter-Wave Single-Pixel Camera, Ieee Access, Vol:8, Pages:191174-191190
• Shin S-H, Alyasiri DF, D'Auria M, et al., 2019, Polymer-Based 3-D Printed Ku-Band Steerable Phased-Array Antenna Subsystem, Ieee Access, Vol:7, Pages:106662-106673
• Sun J, Dawood A, Otter WJ, et al., 2019, Microwave Characterization of Low-Loss FDM 3-D Printed ABS With Dielectric-Filled Metal-Pipe Rectangular Waveguide Spectroscopy, Ieee Access, Vol:7, Pages:95455-95486
• AL-JUBOORI B, ZHOU J, HUANG Y, et al., 2018, Lightweight and low-loss 3-D printed millimeter-wave bandpass filter based on gap-waveguide, Ieee Access, Vol:7, ISSN:2169-3536, Pages:2624-2632
• Sun J, Lucyszyn S, 2018, Extracting complex dielectric properties from reflection-transmission mode spectroscopy, Ieee Access, Vol:6, ISSN:2169-3536, Pages:8302-8321
• Otter WJ, Lucyszyn S, 2017, Hybrid 3-D-Printing Technology for Tunable THz Applications, Proceedings of the IEEE, Vol:105, ISSN:0018-9219, Pages:756-767
• Otter WJ, Lucyszyn S, 2017, Printing: the future of THz, Electronics Letters, Vol:53, ISSN:0013-5194, Pages:443-443
• Otter WJ, Ridler NM, Yasukochi H, et al., 2017, 3-D printed 1.1 THz waveguides, Electronics Letters, Vol:53, ISSN:0013-5194, Pages:471-473
• Muller AA, Sanabria-Codesal E, Moldoveanu A, et al., 2017, Extended Capabilities of the 3-D Smith Chart with Group Delay and Resonator Quality Factor, IEEE Transactions on Microwave Theory and Techniques, Vol:65, ISSN:0018-9480, Pages:10-19