Mervi Paulasto Kröckel

Associate Professor , Electrical engineering at Aalto University School of Business

Schools

  • Aalto University School of Business

Links

Aalto University School of Business

Peer-reviewed scientific articles

Journal article-refereed, Original research

Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability

Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Kröckel, Mervi
2017 in ACS Omega (American Chemical Society)
ISSN: 2470-1343

Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films

Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)
ISSN: 0003-6951

Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates

Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 1543-186X

Force measurements during posterior calvarial vault osteodistraction A novel measurement method

Ritvanen, A.; Savolainen, M.; Nowinski, D.; Saiepour, D.; Paulasto-Kröckel, M.; Hukki, J.; Tukiainen, E.; Leikola, J.
2017 in JOURNAL OF CRANIO-MAXILLOFACIAL SURGERY (Churchill Livingstone)
ISSN: 1010-5182

Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects

Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
2017 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)
ISSN: 0003-6951

Interfacial void segregation of Cl in Cu-Sn micro-connects

Ross, Glenn; Tao, Xiaoma; Broas, Mikael; Mäntyoja, Nikolai; Vuorinen, Vesa; Graff, Andreas; Altmann, Frank; Petzold, Matthias; Paulasto-Kröckel, Mervi
2017 in ELECTRONIC MATERIALS LETTERS (Springer Netherlands)
ISSN: 2093-6788

XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects

Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.
2017 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Choice of osteoblast model critical for studying the effects of electromagnetic stimulation on osteogenesis in vitro

Bique, Maria; Kaivosoja, Emilia; Mikkonen, Marko; Paulasto-Kröckel, Mervi
2016 in ELECTROMAGNETIC BIOLOGY AND MEDICINE (Informa Healthcare)
ISSN: 1536-8378

Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films

Broas, Mikael; Sippola, Perttu; Sajavaara, Timo; Vuorinen, Vesa; Pyymaki Perros, Alexander; Lipsanen, Harri; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A (AVS Science and Technology Society)
ISSN: 0734-2101

Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections

Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection

Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection

Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
ISSN: 0925-8388

Void formation and its impact on Cu-Sn intermetallic compound formation

Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
ISSN: 0925-8388

Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds

Vuorinen, V.; Rautiainen, A.; Heikkinen, H.; Paulasto-Kröckel, M.
2016 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices

Broas, Mikael; Liu, Xuwen; Ge, Yanling; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)
ISSN: 0021-8979

Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation

Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures

Xu, Hongbo; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
ISSN: 0925-8388

Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels

Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)
ISSN: 0363-907X

Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material

Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)
ISSN: 0363-907X

Thermodynamic reassessment of Au-Cu-Sn ternary system

Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
ISSN: 0925-8388

Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading

Li, Jue; Broas, Mikael; Raami, Jani; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope

Li, Jue; Broas, Mikael; Makkonen, Joonas; Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (Institute of Electrical and Electronics Engineers Inc.)
ISSN: 1057-7157

The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading

Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Thermodynamic reassessment of Au-Ni-Sn ternary system

Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0364-5916

Thermodynamic modeling of Au-Ce-Sn ternary system

Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0364-5916

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms

Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters

Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies

Karppinen, Juha; Li, Jue; Paulasto-Kröckel, Mervi
2013 in IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (Institute of Electrical and Electronics Engineers Inc.)
ISSN: 1530-4388

Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading

Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)
ISSN: 0957-4522

Mesh-based method for measuring intracranial volume in patients with craniosynostosis

Ritvanen, Antti G.; de Oliveira, Marcelo Elias; Koivikko, Mika P.; Hallila, Harri O.; Haaja, Juha K.; Koljonen, Virve S.; Leikola, Junnu P.; Hukki, Jyri J.; Paulasto-Krockel, Mervi M.
2013 in INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY (Springer Verlag)
ISSN: 1861-6410

Wafer-level SLID bonding for MEMS encapsulation

Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in ADVANCES IN MANUFACTURING (Springer Science + Business Media)
ISSN: 2095-3127

Thermodynamic assessment of Au-Ho and Au-Tm binary systems

Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0364-5916

“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”

Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Shock impact reliability characterization of a handheld product in accelerated tests and use environment

Karppinen, Juha; Li, Jue; Pakarinen, Jyri; Mattila, Toni; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections

Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading

Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive

Li, Jue; Turunen, Markus; Niiranen, Sini; Chen, Hongtao; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test

Li, Jue; Tarvainen, Tapio; Rich, Jaana; Turunen, Markus; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling

Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)
ISSN: 0884-2914

Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study

de Oliveira, Marcelo Elias; Hallila, Harri; Ritvanen, Antti; Buechler, Philippe; Paulasto, Mervi; Hukki, Jyri
2011 in JOURNAL OF PEDIATRIC SURGERY (W.B. Saunders Ltd)
ISSN: 0022-3468

Thermodynamic assessment of Au-La and Au-Er binary systems

Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
ISSN: 0925-8388

Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers

Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)
ISSN: 0361-5235

Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests

Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi
2011 in SOLDERING AND SURFACE MOUNT TECHNOLOGY (Emerald Group Publishing Ltd.)
ISSN: 0954-0911

Toward comprehensive reliability assessment of electronic component boards by a combined loading approach

Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Toward comprehensive reliability assessment of electronics by a combined loading approach

Mattila, T. T.; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment

Karppinen, Juha; Mattila, Toni T.; Li, Jue; Paulasto-Kröckel, Mervi
2010 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)
ISSN: 0026-2714

Impurity and alloying effects on interfacial reaction layers in Pb-free soldering

Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)
ISSN: 0927-796X

FEM simulation for reliability assessment of component boards drop tests at various temperatures

Li, Jue; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2010 in SIMULATION MODELLING PRACTICE AND THEORY (Elsevier)
ISSN: 1569-190X

Simulation of dynamic recrystallization in solder interconnections during thermal cycling

Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.
2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)
ISSN: 0927-0256

Active Brazing of Al2O3 with Ag-Cu-Ti Filler Alloys

Paulasto, M.; Kivilahti, Jorma
1998 in Journal of Material Research (Elsevier)

Joining of silicon nitride via a transient liquid

Paulasto-Kröckel, Mervi; Ceccone, G.; Peteves, S. D.
1997 in SCRIPTA MATERIALIA (Elsevier Limited)
ISSN: 1359-6462

Interfacial Reactions in the Ti/Si3N4 and TiN/Si Diffusion Couples

Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.K.
1995 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)

Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys

Paulasto, M.; Kivilahti, J.
1995 in Scripta Metallurgica et Materialia (Pergamon Press Ltd.)

Thermodynamic and experimental study of Ti-Ag-Cu alloys

Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.
1995 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)

Review article, Literature review, Systematic review

Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering

Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)
ISSN: 0927-796X

Joining silicon nitride to itself and to metals

Peteves, Stathis D.; Ceccone, Giacomo; Paulasto-Kröckel, Mervi; Stamos, Vassilis; Yvon, Pascal
1996 in JOM (Minerals, Metals and Materials Society)
ISSN: 1047-4838

Book section, Chapters in research books

Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling

Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013
ISBN: 978-953-51-062-4

Conference proceedings

Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test

Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2017 in Materials Today: Proceedings (Elsevier)
ISSN: 2214-7853

Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology

Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi
2016 in IFMBE proceedings (Springer Verlag)
ISBN: 9789812878168
ISSN: 1680-0737

Design for reliability of Au-Sn and Cu-Sn based SLID bonds

Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi
2016
ISBN: 978-0-9568086-1-5

Comparative study on radio frequency and reliability performance of electronically conductive adhesives

Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi
2016
ISBN: 978-1-5090-1402-6

Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism

Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi
2015
ISBN: 9781479999514

Improved Methods for Development of High Reliability Electronics

Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014

Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS

Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe
2014

Improving the function of dopamine electrodes with novel carbon materials

Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi
2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)
ISBN: 978-1-4577-0216-7
ISSN: 1557-170X

Reliability assessment of a MEMS microphone under shock impact loading

Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit
2013
ISBN: 978-1-4673-6137-8

Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation

Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in European Microelectronics Packaging Conference (IEEE CPMT)
ISBN: 978-2-95-274671-7
ISSN: 2165-2341

Reliability of wafer-level SLID bonds for MEMS encapsulation

Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013

Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope

Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012
ISBN: 978-1-4673-1966-9

Finite element modeling for reliability assessment of solder interconnections in a power transistor

Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi
2012
ISBN: 978-1-4673-4645-0

Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope

Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012
ISBN: 978-1-4673-4645-0

Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices

Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012
ISBN: 978-1-4673-4645-0

Thermal Investigation of a Battery Module for Work Machines

Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011
ISBN: 978-1-4577-0105-4

Effects of shock impact repetition frequency on the reliability of component boards

Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011
ISBN: 978-1-61284-497-8
ISSN: 0569-5503

Development of methods for reliability assessment of 3-axial MEMS gyroscopes

Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011
ISBN: 978-952-99751-8-1

Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing

Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2011

Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques

Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri
2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)
ISBN: 978-1-4244-4124-2
ISSN: 1557-170X

Formation of mechanical strains in the component board of a high-end handheld product during shock impact

Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2010
ISBN: 978-1-4244-8553-6

Failure mechanism of solder interconnections under thermal cycling conditions

Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen
2010
ISBN: 978-1-4244-8553-6

Toward comprehensive reliability testing of electronic component boards

Mattila, Toni T.; Paulasto-Kröckel, Mervi
2010

Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections

Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi
2010
ISBN: 978-1-4244-6410-4
ISSN: 0569-5503

On the role of electromigration in power cycling tests

Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi
2010
ISBN: 978-1-4244-8553-6

Understanding materials compatibility issues in electronics packaging

Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.
2009
ISBN: 9781424451005

Non-refereed scientific articles

Unrefereed conference proceedings

Key parameters influencing Cu-Sn interfacial void formation

Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in Electronics Packaging Technology Conference Proceedings (IEEE)
ISBN: 978-1-5090-4368-2

Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone

Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi
2015
ISBN: 9781479986088

Void Formation in Cu-Sn Micro-Connects

Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015
ISBN: 978-1-4799-8609-5

Void formation in Cu-Sn SLID bonding for MEMS

Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014
ISBN: 9781479940264

High.speed mechanical impact reliability of solder interconnections in high-power LEDs

Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi
2010
ISBN: 978-1-4244-7026-6

Scientific books (monographs)

Book

Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach

Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma
2012
ISBN: 978-1-4471-2470-2

Publications intended for professional communities

Article in professional conference proceedings

Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging

Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014

Text book or professional handbook or guidebook or dictionary

Handbook of silicon based MEMS materials and technologies

Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko
2015
ISBN: 978-0-323-29965-7

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