Mervi Paulasto Kröckel
Associate Professor , Electrical engineering at Aalto University School of Business
Schools
- Aalto University School of Business
Links
Biography
Aalto University School of Business
Peer-reviewed scientific articles
Journal article-refereed, Original researchChemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability
Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Kröckel, Mervi2017 in ACS Omega (American Chemical Society)ISSN: 2470-1343Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)ISSN: 0003-6951Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates
Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 1543-186XForce measurements during posterior calvarial vault osteodistraction A novel measurement method
Ritvanen, A.; Savolainen, M.; Nowinski, D.; Saiepour, D.; Paulasto-Kröckel, M.; Hukki, J.; Tukiainen, E.; Leikola, J.2017 in JOURNAL OF CRANIO-MAXILLOFACIAL SURGERY (Churchill Livingstone)ISSN: 1010-5182Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.2017 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)ISSN: 0003-6951Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, Glenn; Tao, Xiaoma; Broas, Mikael; Mäntyoja, Nikolai; Vuorinen, Vesa; Graff, Andreas; Altmann, Frank; Petzold, Matthias; Paulasto-Kröckel, Mervi2017 in ELECTRONIC MATERIALS LETTERS (Springer Netherlands)ISSN: 2093-6788XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.2017 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Choice of osteoblast model critical for studying the effects of electromagnetic stimulation on osteogenesis in vitro
Bique, Maria; Kaivosoja, Emilia; Mikkonen, Marko; Paulasto-Kröckel, Mervi2016 in ELECTROMAGNETIC BIOLOGY AND MEDICINE (Informa Healthcare)ISSN: 1536-8378Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films
Broas, Mikael; Sippola, Perttu; Sajavaara, Timo; Vuorinen, Vesa; Pyymaki Perros, Alexander; Lipsanen, Harri; Paulasto-Kröckel, Mervi2016 in JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A (AVS Science and Technology Society)ISSN: 0734-2101Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Void formation and its impact on Cu-Sn intermetallic compound formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds
Vuorinen, V.; Rautiainen, A.; Heikkinen, H.; Paulasto-Kröckel, M.2016 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices
Broas, Mikael; Liu, Xuwen; Ge, Yanling; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation
Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures
Xu, Hongbo; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi2015 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XHeat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XThermodynamic reassessment of Au-Cu-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
Li, Jue; Broas, Mikael; Raami, Jani; Mattila, Toni T.; Paulasto-Kröckel, Mervi2014 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope
Li, Jue; Broas, Mikael; Makkonen, Joonas; Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1057-7157The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading
Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermodynamic reassessment of Au-Ni-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Thermodynamic modeling of Au-Ce-Sn ternary system
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies
Karppinen, Juha; Li, Jue; Paulasto-Kröckel, Mervi2013 in IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1530-4388Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522Mesh-based method for measuring intracranial volume in patients with craniosynostosis
Ritvanen, Antti G.; de Oliveira, Marcelo Elias; Koivikko, Mika P.; Hallila, Harri O.; Haaja, Juha K.; Koljonen, Virve S.; Leikola, Junnu P.; Hukki, Jyri J.; Paulasto-Krockel, Mervi M.2013 in INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY (Springer Verlag)ISSN: 1861-6410Wafer-level SLID bonding for MEMS encapsulation
Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 in ADVANCES IN MANUFACTURING (Springer Science + Business Media)ISSN: 2095-3127Thermodynamic assessment of Au-Ho and Au-Tm binary systems
Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Shock impact reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Li, Jue; Pakarinen, Jyri; Mattila, Toni; Paulasto-Kröckel, Mervi2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Li, Jue; Turunen, Markus; Niiranen, Sini; Chen, Hongtao; Paulasto-Kröckel, Mervi2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
Li, Jue; Tarvainen, Tapio; Rich, Jaana; Turunen, Markus; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi2011 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)ISSN: 0884-2914Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study
de Oliveira, Marcelo Elias; Hallila, Harri; Ritvanen, Antti; Buechler, Philippe; Paulasto, Mervi; Hukki, Jyri2011 in JOURNAL OF PEDIATRIC SURGERY (W.B. Saunders Ltd)ISSN: 0022-3468Thermodynamic assessment of Au-La and Au-Er binary systems
Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi2011 in SOLDERING AND SURFACE MOUNT TECHNOLOGY (Emerald Group Publishing Ltd.)ISSN: 0954-0911Toward comprehensive reliability assessment of electronic component boards by a combined loading approach
Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Toward comprehensive reliability assessment of electronics by a combined loading approach
Mattila, T. T.; Paulasto-Kröckel, Mervi2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Mattila, Toni T.; Li, Jue; Paulasto-Kröckel, Mervi2010 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XFEM simulation for reliability assessment of component boards drop tests at various temperatures
Li, Jue; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2010 in SIMULATION MODELLING PRACTICE AND THEORY (Elsevier)ISSN: 1569-190XSimulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)ISSN: 0927-0256Active Brazing of Al2O3 with Ag-Cu-Ti Filler Alloys
Paulasto, M.; Kivilahti, Jorma1998 in Journal of Material Research (Elsevier)Joining of silicon nitride via a transient liquid
Paulasto-Kröckel, Mervi; Ceccone, G.; Peteves, S. D.1997 in SCRIPTA MATERIALIA (Elsevier Limited)ISSN: 1359-6462Interfacial Reactions in the Ti/Si3N4 and TiN/Si Diffusion Couples
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.K.1995 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys
Paulasto, M.; Kivilahti, J.1995 in Scripta Metallurgica et Materialia (Pergamon Press Ltd.)Thermodynamic and experimental study of Ti-Ag-Cu alloys
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.1995 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)Review article, Literature review, Systematic reviewImpurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XJoining silicon nitride to itself and to metals
Peteves, Stathis D.; Ceccone, Giacomo; Paulasto-Kröckel, Mervi; Stamos, Vassilis; Yvon, Pascal1996 in JOM (Minerals, Metals and Materials Society)ISSN: 1047-4838Book section, Chapters in research booksSimulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 ISBN: 978-953-51-062-4Conference proceedingsVertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2017 in Materials Today: Proceedings (Elsevier)ISSN: 2214-7853Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology
Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi2016 in IFMBE proceedings (Springer Verlag)ISBN: 9789812878168ISSN: 1680-0737Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi2016 ISBN: 978-0-9568086-1-5Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi2016 ISBN: 978-1-5090-1402-6Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi2015 ISBN: 9781479999514Improved Methods for Development of High Reliability Electronics
Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi2014 Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe2014 Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7ISSN: 1557-170XReliability assessment of a MEMS microphone under shock impact loading
Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit2013 ISBN: 978-1-4673-6137-8Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 in European Microelectronics Packaging Conference (IEEE CPMT)ISBN: 978-2-95-274671-7ISSN: 2165-2341Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-1966-9Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope
Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-4577-0105-4Effects of shock impact repetition frequency on the reliability of component boards
Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-61284-497-8ISSN: 0569-5503Development of methods for reliability assessment of 3-axial MEMS gyroscopes
Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-952-99751-8-1Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi2011 Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques
Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)ISBN: 978-1-4244-4124-2ISSN: 1557-170XFormation of mechanical strains in the component board of a high-end handheld product during shock impact
Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Failure mechanism of solder interconnections under thermal cycling conditions
Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen2010 ISBN: 978-1-4244-8553-6Toward comprehensive reliability testing of electronic component boards
Mattila, Toni T.; Paulasto-Kröckel, Mervi2010 Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-6410-4ISSN: 0569-5503On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.2009 ISBN: 9781424451005Non-refereed scientific articles
Unrefereed conference proceedingsKey parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi2015 ISBN: 9781479986088Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 ISBN: 978-1-4799-8609-5Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 ISBN: 9781479940264High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-7026-6Scientific books (monographs)
BookInterfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsMechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 Text book or professional handbook or guidebook or dictionaryHandbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko2015 ISBN: 978-0-323-29965-7
Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability
Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Kröckel, Mervi
2017 in ACS Omega (American Chemical Society)ISSN: 2470-1343
Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)ISSN: 0003-6951
Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates
Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 1543-186X
Force measurements during posterior calvarial vault osteodistraction A novel measurement method
Ritvanen, A.; Savolainen, M.; Nowinski, D.; Saiepour, D.; Paulasto-Kröckel, M.; Hukki, J.; Tukiainen, E.; Leikola, J.
2017 in JOURNAL OF CRANIO-MAXILLOFACIAL SURGERY (Churchill Livingstone)ISSN: 1010-5182
Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
2017 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)ISSN: 0003-6951
Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, Glenn; Tao, Xiaoma; Broas, Mikael; Mäntyoja, Nikolai; Vuorinen, Vesa; Graff, Andreas; Altmann, Frank; Petzold, Matthias; Paulasto-Kröckel, Mervi
2017 in ELECTRONIC MATERIALS LETTERS (Springer Netherlands)ISSN: 2093-6788
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.
2017 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Choice of osteoblast model critical for studying the effects of electromagnetic stimulation on osteogenesis in vitro
Bique, Maria; Kaivosoja, Emilia; Mikkonen, Marko; Paulasto-Kröckel, Mervi
2016 in ELECTROMAGNETIC BIOLOGY AND MEDICINE (Informa Healthcare)ISSN: 1536-8378
Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films
Broas, Mikael; Sippola, Perttu; Sajavaara, Timo; Vuorinen, Vesa; Pyymaki Perros, Alexander; Lipsanen, Harri; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A (AVS Science and Technology Society)ISSN: 0734-2101
Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Void formation and its impact on Cu-Sn intermetallic compound formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds
Vuorinen, V.; Rautiainen, A.; Heikkinen, H.; Paulasto-Kröckel, M.
2016 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices
Broas, Mikael; Liu, Xuwen; Ge, Yanling; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979
Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation
Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures
Xu, Hongbo; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907X
Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907X
Thermodynamic reassessment of Au-Cu-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
Li, Jue; Broas, Mikael; Raami, Jani; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope
Li, Jue; Broas, Mikael; Makkonen, Joonas; Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1057-7157
The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading
Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermodynamic reassessment of Au-Ni-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
Thermodynamic modeling of Au-Ce-Sn ternary system
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies
Karppinen, Juha; Li, Jue; Paulasto-Kröckel, Mervi
2013 in IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1530-4388
Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522
Mesh-based method for measuring intracranial volume in patients with craniosynostosis
Ritvanen, Antti G.; de Oliveira, Marcelo Elias; Koivikko, Mika P.; Hallila, Harri O.; Haaja, Juha K.; Koljonen, Virve S.; Leikola, Junnu P.; Hukki, Jyri J.; Paulasto-Krockel, Mervi M.
2013 in INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY (Springer Verlag)ISSN: 1861-6410
Wafer-level SLID bonding for MEMS encapsulation
Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in ADVANCES IN MANUFACTURING (Springer Science + Business Media)ISSN: 2095-3127
Thermodynamic assessment of Au-Ho and Au-Tm binary systems
Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Shock impact reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Li, Jue; Pakarinen, Jyri; Mattila, Toni; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Li, Jue; Turunen, Markus; Niiranen, Sini; Chen, Hongtao; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
Li, Jue; Tarvainen, Tapio; Rich, Jaana; Turunen, Markus; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)ISSN: 0884-2914
Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study
de Oliveira, Marcelo Elias; Hallila, Harri; Ritvanen, Antti; Buechler, Philippe; Paulasto, Mervi; Hukki, Jyri
2011 in JOURNAL OF PEDIATRIC SURGERY (W.B. Saunders Ltd)ISSN: 0022-3468
Thermodynamic assessment of Au-La and Au-Er binary systems
Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi
2011 in SOLDERING AND SURFACE MOUNT TECHNOLOGY (Emerald Group Publishing Ltd.)ISSN: 0954-0911
Toward comprehensive reliability assessment of electronic component boards by a combined loading approach
Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Toward comprehensive reliability assessment of electronics by a combined loading approach
Mattila, T. T.; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Mattila, Toni T.; Li, Jue; Paulasto-Kröckel, Mervi
2010 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796X
FEM simulation for reliability assessment of component boards drop tests at various temperatures
Li, Jue; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2010 in SIMULATION MODELLING PRACTICE AND THEORY (Elsevier)ISSN: 1569-190X
Simulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.
2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)ISSN: 0927-0256
Active Brazing of Al2O3 with Ag-Cu-Ti Filler Alloys
Paulasto, M.; Kivilahti, Jorma
1998 in Journal of Material Research (Elsevier)Joining of silicon nitride via a transient liquid
Paulasto-Kröckel, Mervi; Ceccone, G.; Peteves, S. D.
1997 in SCRIPTA MATERIALIA (Elsevier Limited)ISSN: 1359-6462
Interfacial Reactions in the Ti/Si3N4 and TiN/Si Diffusion Couples
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.K.
1995 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys
Paulasto, M.; Kivilahti, J.
1995 in Scripta Metallurgica et Materialia (Pergamon Press Ltd.)Thermodynamic and experimental study of Ti-Ag-Cu alloys
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.
1995 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796X
Joining silicon nitride to itself and to metals
Peteves, Stathis D.; Ceccone, Giacomo; Paulasto-Kröckel, Mervi; Stamos, Vassilis; Yvon, Pascal
1996 in JOM (Minerals, Metals and Materials Society)ISSN: 1047-4838
Book section, Chapters in research booksSimulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 ISBN: 978-953-51-062-4Conference proceedingsVertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2017 in Materials Today: Proceedings (Elsevier)ISSN: 2214-7853Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology
Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi2016 in IFMBE proceedings (Springer Verlag)ISBN: 9789812878168ISSN: 1680-0737Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi2016 ISBN: 978-0-9568086-1-5Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi2016 ISBN: 978-1-5090-1402-6Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi2015 ISBN: 9781479999514Improved Methods for Development of High Reliability Electronics
Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi2014 Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe2014 Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7ISSN: 1557-170XReliability assessment of a MEMS microphone under shock impact loading
Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit2013 ISBN: 978-1-4673-6137-8Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 in European Microelectronics Packaging Conference (IEEE CPMT)ISBN: 978-2-95-274671-7ISSN: 2165-2341Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-1966-9Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope
Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-4577-0105-4Effects of shock impact repetition frequency on the reliability of component boards
Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-61284-497-8ISSN: 0569-5503Development of methods for reliability assessment of 3-axial MEMS gyroscopes
Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-952-99751-8-1Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi2011 Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques
Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)ISBN: 978-1-4244-4124-2ISSN: 1557-170XFormation of mechanical strains in the component board of a high-end handheld product during shock impact
Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Failure mechanism of solder interconnections under thermal cycling conditions
Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen2010 ISBN: 978-1-4244-8553-6Toward comprehensive reliability testing of electronic component boards
Mattila, Toni T.; Paulasto-Kröckel, Mervi2010 Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-6410-4ISSN: 0569-5503On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.2009 ISBN: 9781424451005Non-refereed scientific articles
Unrefereed conference proceedingsKey parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi2015 ISBN: 9781479986088Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 ISBN: 978-1-4799-8609-5Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 ISBN: 9781479940264High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-7026-6Scientific books (monographs)
BookInterfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsMechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 Text book or professional handbook or guidebook or dictionaryHandbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko2015 ISBN: 978-0-323-29965-7
Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 ISBN: 978-953-51-062-4
Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2017 in Materials Today: Proceedings (Elsevier)ISSN: 2214-7853
Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology
Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi
2016 in IFMBE proceedings (Springer Verlag)ISBN: 9789812878168
ISSN: 1680-0737
Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi
2016 ISBN: 978-0-9568086-1-5
Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi
2016 ISBN: 978-1-5090-1402-6
Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi
2015 ISBN: 9781479999514
Improved Methods for Development of High Reliability Electronics
Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014 Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe
2014 Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi
2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7
ISSN: 1557-170X
Reliability assessment of a MEMS microphone under shock impact loading
Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit
2013 ISBN: 978-1-4673-6137-8
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in European Microelectronics Packaging Conference (IEEE CPMT)ISBN: 978-2-95-274671-7
ISSN: 2165-2341
Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-1966-9
Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope
Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011 ISBN: 978-1-4577-0105-4
Effects of shock impact repetition frequency on the reliability of component boards
Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 ISBN: 978-1-61284-497-8
ISSN: 0569-5503
Development of methods for reliability assessment of 3-axial MEMS gyroscopes
Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 ISBN: 978-952-99751-8-1
Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2011 Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques
Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri
2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)ISBN: 978-1-4244-4124-2
ISSN: 1557-170X
Formation of mechanical strains in the component board of a high-end handheld product during shock impact
Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-8553-6
Failure mechanism of solder interconnections under thermal cycling conditions
Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen
2010 ISBN: 978-1-4244-8553-6
Toward comprehensive reliability testing of electronic component boards
Mattila, Toni T.; Paulasto-Kröckel, Mervi
2010 Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-6410-4
ISSN: 0569-5503
On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-8553-6
Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.
2009 ISBN: 9781424451005
Non-refereed scientific articles
Unrefereed conference proceedingsKey parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi2015 ISBN: 9781479986088Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 ISBN: 978-1-4799-8609-5Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 ISBN: 9781479940264High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-7026-6Scientific books (monographs)
BookInterfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsMechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 Text book or professional handbook or guidebook or dictionaryHandbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko2015 ISBN: 978-0-323-29965-7
Key parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2
Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi
2015 ISBN: 9781479986088
Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015 ISBN: 978-1-4799-8609-5
Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014 ISBN: 9781479940264
High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-7026-6
Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma
2012 ISBN: 978-1-4471-2470-2
Publications intended for professional communities
Article in professional conference proceedingsMechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 Text book or professional handbook or guidebook or dictionaryHandbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko2015 ISBN: 978-0-323-29965-7
Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014 Handbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko
2015 ISBN: 978-0-323-29965-7
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Christos Begkos
I am an Assistant Professor in Management Accounting. I completed my PhD studies at AMBS, hold an MSc in Economics from the University of Warwick, and a BSc in Business Administration from the University of Macedonia (Thessaloniki, Greece). Before I joined the Accounting & Finance division, I...
Irene Roele
Irene Roele specialises in strategy work with senior leadership teams. She has excellent process facilitation skills, having studied process consulting and change at the Tavistock Institute, as well as domain knowledge and the valuable combination of academic rigour and business experience. Her ...
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