Mervi Paulasto Kröckel
Associate Professor , Electrical engineering at Aalto University School of Business

Schools
- Aalto University School of Business
Links
Biography
Aalto University School of Business
Peer-reviewed scientific articles
Journal article-refereed, Original researchChemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability
Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Kröckel, Mervi2017 in ACS Omega (American Chemical Society)ISSN: 2470-1343Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)ISSN: 0003-6951Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates
Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 1543-186XForce measurements during posterior calvarial vault osteodistraction A novel measurement method
Ritvanen, A.; Savolainen, M.; Nowinski, D.; Saiepour, D.; Paulasto-Kröckel, M.; Hukki, J.; Tukiainen, E.; Leikola, J.2017 in JOURNAL OF CRANIO-MAXILLOFACIAL SURGERY (Churchill Livingstone)ISSN: 1010-5182Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.2017 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)ISSN: 0003-6951Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, Glenn; Tao, Xiaoma; Broas, Mikael; Mäntyoja, Nikolai; Vuorinen, Vesa; Graff, Andreas; Altmann, Frank; Petzold, Matthias; Paulasto-Kröckel, Mervi2017 in ELECTRONIC MATERIALS LETTERS (Springer Netherlands)ISSN: 2093-6788XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.2017 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Choice of osteoblast model critical for studying the effects of electromagnetic stimulation on osteogenesis in vitro
Bique, Maria; Kaivosoja, Emilia; Mikkonen, Marko; Paulasto-Kröckel, Mervi2016 in ELECTROMAGNETIC BIOLOGY AND MEDICINE (Informa Healthcare)ISSN: 1536-8378Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films
Broas, Mikael; Sippola, Perttu; Sajavaara, Timo; Vuorinen, Vesa; Pyymaki Perros, Alexander; Lipsanen, Harri; Paulasto-Kröckel, Mervi2016 in JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A (AVS Science and Technology Society)ISSN: 0734-2101Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Void formation and its impact on Cu-Sn intermetallic compound formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds
Vuorinen, V.; Rautiainen, A.; Heikkinen, H.; Paulasto-Kröckel, M.2016 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices
Broas, Mikael; Liu, Xuwen; Ge, Yanling; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation
Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures
Xu, Hongbo; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi2015 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XHeat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XThermodynamic reassessment of Au-Cu-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
Li, Jue; Broas, Mikael; Raami, Jani; Mattila, Toni T.; Paulasto-Kröckel, Mervi2014 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope
Li, Jue; Broas, Mikael; Makkonen, Joonas; Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1057-7157The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading
Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermodynamic reassessment of Au-Ni-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Thermodynamic modeling of Au-Ce-Sn ternary system
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies
Karppinen, Juha; Li, Jue; Paulasto-Kröckel, Mervi2013 in IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1530-4388Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522Mesh-based method for measuring intracranial volume in patients with craniosynostosis
Ritvanen, Antti G.; de Oliveira, Marcelo Elias; Koivikko, Mika P.; Hallila, Harri O.; Haaja, Juha K.; Koljonen, Virve S.; Leikola, Junnu P.; Hukki, Jyri J.; Paulasto-Krockel, Mervi M.2013 in INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY (Springer Verlag)ISSN: 1861-6410Wafer-level SLID bonding for MEMS encapsulation
Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 in ADVANCES IN MANUFACTURING (Springer Science + Business Media)ISSN: 2095-3127Thermodynamic assessment of Au-Ho and Au-Tm binary systems
Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Shock impact reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Li, Jue; Pakarinen, Jyri; Mattila, Toni; Paulasto-Kröckel, Mervi2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Li, Jue; Turunen, Markus; Niiranen, Sini; Chen, Hongtao; Paulasto-Kröckel, Mervi2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
Li, Jue; Tarvainen, Tapio; Rich, Jaana; Turunen, Markus; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi2011 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)ISSN: 0884-2914Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study
de Oliveira, Marcelo Elias; Hallila, Harri; Ritvanen, Antti; Buechler, Philippe; Paulasto, Mervi; Hukki, Jyri2011 in JOURNAL OF PEDIATRIC SURGERY (W.B. Saunders Ltd)ISSN: 0022-3468Thermodynamic assessment of Au-La and Au-Er binary systems
Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi2011 in SOLDERING AND SURFACE MOUNT TECHNOLOGY (Emerald Group Publishing Ltd.)ISSN: 0954-0911Toward comprehensive reliability assessment of electronic component boards by a combined loading approach
Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Toward comprehensive reliability assessment of electronics by a combined loading approach
Mattila, T. T.; Paulasto-Kröckel, Mervi2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Mattila, Toni T.; Li, Jue; Paulasto-Kröckel, Mervi2010 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XFEM simulation for reliability assessment of component boards drop tests at various temperatures
Li, Jue; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2010 in SIMULATION MODELLING PRACTICE AND THEORY (Elsevier)ISSN: 1569-190XSimulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)ISSN: 0927-0256Active Brazing of Al2O3 with Ag-Cu-Ti Filler Alloys
Paulasto, M.; Kivilahti, Jorma1998 in Journal of Material Research (Elsevier)Joining of silicon nitride via a transient liquid
Paulasto-Kröckel, Mervi; Ceccone, G.; Peteves, S. D.1997 in SCRIPTA MATERIALIA (Elsevier Limited)ISSN: 1359-6462Interfacial Reactions in the Ti/Si3N4 and TiN/Si Diffusion Couples
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.K.1995 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys
Paulasto, M.; Kivilahti, J.1995 in Scripta Metallurgica et Materialia (Pergamon Press Ltd.)Thermodynamic and experimental study of Ti-Ag-Cu alloys
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.1995 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)
Chemically Stable Atomic-Layer-Deposited Al2O3 Films for Processability
Broas, Mikael; Kanninen, Olli; Vuorinen, Vesa; Tilli, Markku; Paulasto-Kröckel, Mervi
2017 in ACS Omega (American Chemical Society)ISSN: 2470-1343
Blistering mechanisms of atomic-layer-deposited AlN and Al2O3 films
Broas, Mikael; Jiang, Hua; Graff, Andreas; Sajavaara, Timo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)ISSN: 0003-6951
Interfacial Reactions Between ZnAl(Ge) Solders on Cu and Ni Substrates
Rautiainen, Antti; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 1543-186X
Force measurements during posterior calvarial vault osteodistraction A novel measurement method
Ritvanen, A.; Savolainen, M.; Nowinski, D.; Saiepour, D.; Paulasto-Kröckel, M.; Hukki, J.; Tukiainen, E.; Leikola, J.
2017 in JOURNAL OF CRANIO-MAXILLOFACIAL SURGERY (Churchill Livingstone)ISSN: 1010-5182
Gigahertz scanning acoustic microscopy analysis of voids in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Petzold, M.; Paulasto-Kröckel, M.; Brand, S.
2017 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)ISSN: 0003-6951
Interfacial void segregation of Cl in Cu-Sn micro-connects
Ross, Glenn; Tao, Xiaoma; Broas, Mikael; Mäntyoja, Nikolai; Vuorinen, Vesa; Graff, Andreas; Altmann, Frank; Petzold, Matthias; Paulasto-Kröckel, Mervi
2017 in ELECTRONIC MATERIALS LETTERS (Springer Netherlands)ISSN: 2093-6788
XRD and ToF-SIMS study of intermetallic void formation in Cu-Sn micro-connects
Ross, G.; Vuorinen, V.; Krause, M.; Reissaus, S.; Petzold, M.; Paulasto-Kröckel, M.
2017 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Choice of osteoblast model critical for studying the effects of electromagnetic stimulation on osteogenesis in vitro
Bique, Maria; Kaivosoja, Emilia; Mikkonen, Marko; Paulasto-Kröckel, Mervi
2016 in ELECTROMAGNETIC BIOLOGY AND MEDICINE (Informa Healthcare)ISSN: 1536-8378
Structural and chemical analysis of annealed plasma-enhanced atomic layer deposition aluminum nitride films
Broas, Mikael; Sippola, Perttu; Sajavaara, Timo; Vuorinen, Vesa; Pyymaki Perros, Alexander; Lipsanen, Harri; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF VACUUM SCIENCE AND TECHNOLOGY A (AVS Science and Technology Society)ISSN: 0734-2101
Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermodynamic reassessment of the Au-Pt-Sn system and microstructural evolution of the (AuSn)eut-Pt interconnection
Dong, Hongqun; Vuorinen, Vesa; Broas, Mikael; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Void formation and its impact on Cu-Sn intermetallic compound formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2016 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Optimization of contact metallizations for reliable wafer level Au[sbnd]Sn bonds
Vuorinen, V.; Rautiainen, A.; Heikkinen, H.; Paulasto-Kröckel, M.
2016 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Galvanic corrosion of structural non-stoichiometric silicon nitride thin films and its implications on reliability of microelectromechanical devices
Broas, Mikael; Liu, Xuwen; Ge, Yanling; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979
Microstructural Characterization and Mechanical Performance of Wafer-Level SLID Bonded Au-Sn and Cu-Sn Seal Rings for MEMS Encapsulation
Rautiainen, Antti; Xu, Hongbo; Österlund, Elmeri; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Solid-state reaction of electroplated thin film Au/Sn couple at low temperatures
Xu, Hongbo; Vuorinen, Vesa; Dong, Hongqun; Paulasto-Kröckel, Mervi
2015 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907X
Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi
2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907X
Thermodynamic reassessment of Au-Cu-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading
Li, Jue; Broas, Mikael; Raami, Jani; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Shock Impact Reliability and Failure Analysis of a Three-Axis MEMS Gyroscope
Li, Jue; Broas, Mikael; Makkonen, Joonas; Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF MICROELECTROMECHANICAL SYSTEMS (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1057-7157
The reliability of microalloyed Sn-Ag-Cu solder interconnections under cyclic thermal and mechanical shock loading
Mattila, Toni T.; Hokka, Jussi; Paulasto-Kröckel, Mervi
2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermodynamic reassessment of Au-Ni-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
Thermodynamic modeling of Au-Ce-Sn ternary system
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections-Part 2: Failure Mechanisms
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Thermal Cycling Reliability of Sn-Ag-Cu Solder Interconnections.Part 1: Effects of Test Parameters
Hokka, Jussi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
The Effects of Concurrent Power and Vibration Loads on the Reliability of Board-Level Interconnections in Power Electronic Assemblies
Karppinen, Juha; Li, Jue; Paulasto-Kröckel, Mervi
2013 in IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITY (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1530-4388
Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522
Mesh-based method for measuring intracranial volume in patients with craniosynostosis
Ritvanen, Antti G.; de Oliveira, Marcelo Elias; Koivikko, Mika P.; Hallila, Harri O.; Haaja, Juha K.; Koljonen, Virve S.; Leikola, Junnu P.; Hukki, Jyri J.; Paulasto-Krockel, Mervi M.
2013 in INTERNATIONAL JOURNAL OF COMPUTER ASSISTED RADIOLOGY AND SURGERY (Springer Verlag)ISSN: 1861-6410
Wafer-level SLID bonding for MEMS encapsulation
Xu, Hongbo; Suni, Tommi; Vuorinen, Vesa; Li, Jue; Heikkinen, Hannele; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in ADVANCES IN MANUFACTURING (Springer Science + Business Media)ISSN: 2095-3127
Thermodynamic assessment of Au-Ho and Au-Tm binary systems
Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916
“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Shock impact reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Li, Jue; Pakarinen, Jyri; Mattila, Toni; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
A reliability study of adhesion mechanism between liquid crystal polymer and silicone adhesive
Li, Jue; Turunen, Markus; Niiranen, Sini; Chen, Hongtao; Paulasto-Kröckel, Mervi
2012 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Hyperelastic Property Measurements of Heat-Cured Silicone Adhesives by Cyclic Uniaxial Tensile Test
Li, Jue; Tarvainen, Tapio; Rich, Jaana; Turunen, Markus; Paulasto-Kröckel, Mervi
2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Localized recrystallization and cracking of lead-free solder interconnections under thermal cycling
Chen, Hongtao; Mueller, Maik; Mattila, Toni Tuomas; Li, Jue; Liu, Xuwei; Wolter, Klaus-Juerger; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)ISSN: 0884-2914
Feature-invariant image registration method for quantification of surgical outcomes in patients with craniosynostosis: a preliminary study
de Oliveira, Marcelo Elias; Hallila, Harri; Ritvanen, Antti; Buechler, Philippe; Paulasto, Mervi; Hukki, Jyri
2011 in JOURNAL OF PEDIATRIC SURGERY (W.B. Saunders Ltd)ISSN: 0022-3468
Thermodynamic assessment of Au-La and Au-Er binary systems
Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388
Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi
2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235
Finite element analyses and lifetime predictions for SnAgCu solder interconnections in thermal shock tests
Li, Jue; Xu, Hongbo; Hokka, Jussi; Mattila, Toni T.; Chen, Hongtao; Paulasto-Kröckel, Mervi
2011 in SOLDERING AND SURFACE MOUNT TECHNOLOGY (Emerald Group Publishing Ltd.)ISSN: 0954-0911
Toward comprehensive reliability assessment of electronic component boards by a combined loading approach
Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Toward comprehensive reliability assessment of electronics by a combined loading approach
Mattila, T. T.; Paulasto-Kröckel, Mervi
2011 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment
Karppinen, Juha; Mattila, Toni T.; Li, Jue; Paulasto-Kröckel, Mervi
2010 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796X
FEM simulation for reliability assessment of component boards drop tests at various temperatures
Li, Jue; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2010 in SIMULATION MODELLING PRACTICE AND THEORY (Elsevier)ISSN: 1569-190X
Simulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.
2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)ISSN: 0927-0256
Active Brazing of Al2O3 with Ag-Cu-Ti Filler Alloys
Paulasto, M.; Kivilahti, Jorma
1998 in Journal of Material Research (Elsevier)Joining of silicon nitride via a transient liquid
Paulasto-Kröckel, Mervi; Ceccone, G.; Peteves, S. D.
1997 in SCRIPTA MATERIALIA (Elsevier Limited)ISSN: 1359-6462
Interfacial Reactions in the Ti/Si3N4 and TiN/Si Diffusion Couples
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.K.
1995 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)Formation of Interfacial Microstructure in Brazing of the Silicon Nitride with Ti-Activated Ag-Cu filler alloys
Paulasto, M.; Kivilahti, J.
1995 in Scripta Metallurgica et Materialia (Pergamon Press Ltd.)Thermodynamic and experimental study of Ti-Ag-Cu alloys
Paulasto, M.; van Loo, F.J.J.; Kivilahti, J.
1995 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)Review article, Literature review, Systematic reviewImpurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XJoining silicon nitride to itself and to metals
Peteves, Stathis D.; Ceccone, Giacomo; Paulasto-Kröckel, Mervi; Stamos, Vassilis; Yvon, Pascal1996 in JOM (Minerals, Metals and Materials Society)ISSN: 1047-4838
Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796X
Joining silicon nitride to itself and to metals
Peteves, Stathis D.; Ceccone, Giacomo; Paulasto-Kröckel, Mervi; Stamos, Vassilis; Yvon, Pascal
1996 in JOM (Minerals, Metals and Materials Society)ISSN: 1047-4838
Book section, Chapters in research booksSimulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 ISBN: 978-953-51-062-4
Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi
2013 ISBN: 978-953-51-062-4
Conference proceedingsVertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2017 in Materials Today: Proceedings (Elsevier)ISSN: 2214-7853Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology
Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi2016 in IFMBE proceedings (Springer Verlag)ISBN: 9789812878168ISSN: 1680-0737Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi2016 ISBN: 978-0-9568086-1-5Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi2016 ISBN: 978-1-5090-1402-6Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi2015 ISBN: 9781479999514Improved Methods for Development of High Reliability Electronics
Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi2014 Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe2014 Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7ISSN: 1557-170XReliability assessment of a MEMS microphone under shock impact loading
Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit2013 ISBN: 978-1-4673-6137-8Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 in European Microelectronics Packaging Conference (IEEE CPMT)ISBN: 978-2-95-274671-7ISSN: 2165-2341Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi2013 Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-1966-9Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope
Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-4577-0105-4Effects of shock impact repetition frequency on the reliability of component boards
Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-61284-497-8ISSN: 0569-5503Development of methods for reliability assessment of 3-axial MEMS gyroscopes
Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2011 ISBN: 978-952-99751-8-1Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi2011 Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques
Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)ISBN: 978-1-4244-4124-2ISSN: 1557-170XFormation of mechanical strains in the component board of a high-end handheld product during shock impact
Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Failure mechanism of solder interconnections under thermal cycling conditions
Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen2010 ISBN: 978-1-4244-8553-6Toward comprehensive reliability testing of electronic component boards
Mattila, Toni T.; Paulasto-Kröckel, Mervi2010 Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-6410-4ISSN: 0569-5503On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.2009 ISBN: 9781424451005
Vertical cracking of Cu-Sn solid-liquid interdiffusion bond under thermal shock test
Rautiainen, Antti; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi
2017 in Materials Today: Proceedings (Elsevier)ISSN: 2214-7853
Extremely low frequency electromagnetic stimulation alters osteoblast actin filament morphology
Bique, A.-M.; Keskinen, T.; Paulasto-Kröckel, Mervi
2016 in IFMBE proceedings (Springer Verlag)ISBN: 9789812878168
ISSN: 1680-0737
Design for reliability of Au-Sn and Cu-Sn based SLID bonds
Vuorinen, Vesa; Rautiainen, Antti; Paulasto-Kröckel, Mervi
2016 ISBN: 978-0-9568086-1-5
Comparative study on radio frequency and reliability performance of electronically conductive adhesives
Österlund, Elmeri; Vuorinen, Vesa; Jokilahti, Juha; Galkin, Timo; Salmela, Olli; Paulasto-Krockel, Mervi
2016 ISBN: 978-1-5090-1402-6
Study on thermomechanical reliability of power modules and thermal grease pump-out mechanism
Li, Jue; Myllykoski, Pirkka; Paulasto-Kröckel, Mervi
2015 ISBN: 9781479999514
Improved Methods for Development of High Reliability Electronics
Li, Jue; Dong, Hongqun; Vuorinen, Vesa; Karppinen, Juha; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2014 Reliability Performance of Au-Sn and Cu-Sn Wafer Level SLID Bonds for MEMS
Xu, Hongbo; Rautiainen, Antti; Vuorinen, Vesa; Österlund, Elmeri; Paulasto-Kröckel, Mervi; Suni, Tommi; Heikkinen, Hannele; Monnoyer, Philippe
2014 Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi
2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7
ISSN: 1557-170X
Reliability assessment of a MEMS microphone under shock impact loading
Li, Jue; Makkonen, Joonas; Broas, Mikael; Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi; Meng, Jingshi; Dasgupta, Abhijit
2013 ISBN: 978-1-4673-6137-8
Wafer-Level AuSn and CuSn Bonding for MEMS Encapsulation
Suni, Tomi; Xu, Hongbo; Vuorinen, Vesa; Heikkinen, Hannele; Vähänen, Sami; Jaakkola, Antti; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 in European Microelectronics Packaging Conference (IEEE CPMT)ISBN: 978-2-95-274671-7
ISSN: 2165-2341
Reliability of wafer-level SLID bonds for MEMS encapsulation
Xu, Hongbo; Broas, Mikael; Dong, Hongqun; Vuorinen, Vesa; Suni, Tommi; Vähänen, Sami; Monnoyer, Philippe; Paulasto-Kröckel, Mervi
2013 Methods for Reliability Assessment of MEMS Devices - Case Studies of a MEMS Microphone and a 3-Axis MEMS Gyroscope
Hokka, Jussi; Broas, Mikael; Makkonen, Joonas; Raami, Jani; Li, Jue; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-1966-9
Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Reliability Assessment of MEMS Devices A Case Study of a 3 axis Gyroscope
Makkonen, Joonas; Broas, Mikael; Li, Jue; Hokka, Jussi; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi
2012 ISBN: 978-1-4673-4645-0
Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi
2011 ISBN: 978-1-4577-0105-4
Effects of shock impact repetition frequency on the reliability of component boards
Hokka, Jussi; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 ISBN: 978-1-61284-497-8
ISSN: 0569-5503
Development of methods for reliability assessment of 3-axial MEMS gyroscopes
Hokka, Jussi; Hyvönen, Hannes; Li, Jue; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2011 ISBN: 978-952-99751-8-1
Adhesion evaluation of the heat resistant pressure sensitive adhesives at elevated temperatures for MEMS gyroscope testing
Kemppainen, Jarmo; Mattila, Toni T.; Paulasto-Kröckel, Mervi
2011 Postoperative Evaluation of Surgery for Craniosynostosis Based on Image Registration Techniques
Elias de Oliveira, Marcelo; Hallila, Harri; Ritvanen, Antti; Buchler, Philippe; Paulasto-Kröckel, Mervi; Hukki, Jyri
2010 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE CPMT)ISBN: 978-1-4244-4124-2
ISSN: 1557-170X
Formation of mechanical strains in the component board of a high-end handheld product during shock impact
Karppinen, Juha; Pakarinen, Jyri; Mattila, Toni Tuomas; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-8553-6
Failure mechanism of solder interconnections under thermal cycling conditions
Mattila, Toni T.; Mueller, Maik; Paulasto-Kröckel, Mervi; Wolter, Klaus-Juergen
2010 ISBN: 978-1-4244-8553-6
Toward comprehensive reliability testing of electronic component boards
Mattila, Toni T.; Paulasto-Kröckel, Mervi
2010 Effects of thermal cycling parameters on lifetimes and failure mechanism of solder interconnections
Mattila, Toni Tuomas; Xu, Hongbo; Ratia, Otso; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-6410-4
ISSN: 0569-5503
On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-8553-6
Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.
2009 ISBN: 9781424451005
Non-refereed scientific articles
Unrefereed conference proceedingsKey parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi2015 ISBN: 9781479986088Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2015 ISBN: 978-1-4799-8609-5Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014 ISBN: 9781479940264High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-7026-6
Key parameters influencing Cu-Sn interfacial void formation
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2017 in Electronics Packaging Technology Conference Proceedings (IEEE)ISBN: 978-1-5090-4368-2
Galvanic corrosion of silicon-based thin films: A case study of a MEMS microphone
Broas, Mikael; Li, Jue; Liu, Xuwen; Ge, Yanling; Peltonen, Antti; Mattila, Toni Tuomas; Paulasto-Krockel, Mervi
2015 ISBN: 9781479986088
Void Formation in Cu-Sn Micro-Connects
Ross, Glenn; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2015 ISBN: 978-1-4799-8609-5
Void formation in Cu-Sn SLID bonding for MEMS
Ross, Glenn; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014 ISBN: 9781479940264
High.speed mechanical impact reliability of solder interconnections in high-power LEDs
Hokka, Jussi; Caers, Jo; De Jong, Marcel; Peels, Wil; Sykes, Bob; Zhang, Kouchi; Paulasto-Kröckel, Mervi
2010 ISBN: 978-1-4244-7026-6
Scientific books (monographs)
BookInterfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2
Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma
2012 ISBN: 978-1-4471-2470-2
Publications intended for professional communities
Article in professional conference proceedingsMechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2014
Mechanical characterization of SLID bonded Au-Sn and Cu-Sn interconnections for MEMS packaging
Rautiainen, Antti; Österlund, Elmeri; Xu, Hongbo; Vuorinen, Vesa; Paulasto-Kröckel, Mervi
2014 Text book or professional handbook or guidebook or dictionaryHandbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko2015 ISBN: 978-0-323-29965-7
Handbook of silicon based MEMS materials and technologies
Tilli, Markku; Motooka, Teruaki; Airaksinen, Veli-Matti; Franssila, Sami; Paulasto-Kröckel, Mervi; Lindroos, Veikko
2015 ISBN: 978-0-323-29965-7
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