Yong Chen

Yong Chen (Nick) received the B.Eng. degree in electronic and information engineering, Communication University of China (CUC), Beijing, China, in 2005, and the Ph.D. in Engineering degree in microelectronics and solid-state electronics, Institute of Microelectronics of Chinese Academy of Sciences (IMECAS), Beijing, China, in 2010.

From 2010 to 2013, he worked as Post-Doctoral Researcher in Institute of Microelectronics, Tsinghua University, Beijing, China. From 2013 to 2016, he was Research Fellow responsible for high-speed (40+Gb/s) wireline communication and Low Energy Electronic Systems (LEES) project under the Singapore-MIT Alliance for Research and Technology (SMART) on RF CMOS transceiver in VIRTUS/EEE, Nanyang Technological University, Singapore. In 2016, He joined the State Key Laboratory of Analog and Mixed-Signal VLSI (AMSV) of University of Macau, Macao, China, where he is now an Associate Professor.

His research interests include integrated circuit designs involving analog/mixed-signal/RF/mm-wave/sub-THz/wireline.

Dr. Chen was the recipient of the "Haixi" (three places across the Straits) postgraduate integrated circuit design competition (Second Prize) in 2009, the co-recipient of the Best Paper Award at the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS) in 2019, the Best Student Paper Award (Third Place) at the IEEE Radio Frequency Integrated Circuits (RFIC) Symposium in 2021, and the Macao Science and Technology Invention Award (First Prize) in 2020. Dr. Chen was recognized as the top five Associate Editors of IEEE TVLSI Systems in 2020 and the five highest-performing Associate Editors of IEEE TVLSI Systems in 2021.

Dr. Chen serves as an Associate Editor of IEEE Transaction on Very Large Scale Integration (TVLSI) Systems since 2019, a Subject Editor for Circuits & Systems (’22-) and an Associate Editor (’20-) of IET Electronics Letters (EL), an Editor of International Journal of Circuit Theory and Applications (IJCTA) since 2020, Guest Editors of IEEE Transactions on Circuits and Systems I: Regular Papers in 2022 and IEEE Transactions on Circuits and Systems II: Express Briefs (’21-’22) and an Associate Editor of IEEE Access (’19-’21). He serves as a Vice-Chair (’19-’21) and Chair (’21-’23) of IEEE Macau CAS Chapter, a Tutorial Chair of ICCS (’20), a Special Session Co-Chairs of APCCAS (’22), a conference local organization committee of A-SSCC (’19), a member of IEEE Circuits and Systems Society, Circuits and Systems for Communications (CASCOM) Technical Committee (’20-), a member of Technical Program Committee (TPC) of A-SSCC (’21-), APCCAS (’19-), ICTA (’20-), NorCAS (’20-), MWSCAS (’22-), ICECS (’21) and ICSICT (’20, ’22), a Review Committee Member of ISCAS (’21-), and a TPC Co-Chair of ICCS (’21-).

Awards and Recognition

Five highest-performing Associate Editors of IEEE Transaction on Very Large Scale Integration (TVLSI) Systems in 2021

Best Student Paper Award (Third Place) in the IEEE Radio Frequency Integrated Circuits (RFIC 2021) Symposium, Atlanta, GA.

Top five Associate Editors of IEEE Transaction on Very Large Scale Integration (TVLSI) Systems in 2020

Macao Science and Technology Invention Award (First Prize) in 2020

Best Paper Award in the IEEE Asia Pacific Conference on Circuits and Systems (APCCAS 2019), Bangkok, Thailand.

"Haixi" (three places across the Straits) postgraduate integrated circuit design competition (Second Prize) in 2009