Tomi Laurila
Associate Professor, Microsystem technology at Aalto University School of Business
Schools
- Aalto University School of Business
Links
Biography
Aalto University School of Business
Professor Tomi Laurila received the D.Sc. degree (with honours) in electronics production technology from the Helsinki University of Technology in 2001. The thesis was focused on the solid-state reactions in different metal/silicon systems and development of feasible diffusion barriers to be used in Cu metallized IC’s. At the moment he is Associate Professor in the field of Microsystem technology and holds an adjunct professorship on Electronics Reliability and Manufacturing. Presently his research involves the study of interfacial reactions between dissimilar materials used in microsystems, biocompatibility issues related to different types of materials and electrochemical measurements of neurotransmitters from the brain. He has published extensively on the thermodynamic-kinetic analysis of interfacial reactions and issues related to reliability testing of electronic devices. Prof. Laurila is also responsible for the teaching of material science, electronics reliability and bioadaptive technology to under- and post-graduate as well as postdoctoral students.
Peer-reviewed scientific articles
Journal article-refereed, Original researchDoping as a means to probe the potential dependence of dopamine adsorption on carbon-based surfaces A first-principles study
Aarva, Anja; Laurila, Tomi; Caro, Miguel A.2017 in JOURNAL OF CHEMICAL PHYSICS (AMER INST PHYSICS)ISSN: 0021-9606Redox Potentials from Ab Initio Molecular Dynamics and Explicit Entropy Calculations Application to Transition Metals in Aqueous Solution
Caro, Miguel A.; Lopez Acevedo, Olga; Laurila, Tomi2017 in JOURNAL OF CHEMICAL THEORY AND COMPUTATION (AMER CHEMICAL SOC)ISSN: 1549-9618Amorphous carbon thin film electrodes with intrinsic Pt-gradient for hydrogen peroxide detection
Isoaho, Noora; Wester, Niklas; Peltola, Emilia; Johansson, Leena Sisko; Boronat, Ana; Koskinen, Jari; Feliu, Juan; Climent, Victor; Laurila, Tomi2017 in Electrochimica Acta (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0013-4686Carbon Nanostructure Based Platform for Enzymatic Glutamate Biosensors
Isoaho, Noora; Peltola, Emilia; Sainio, Sami; Wester, Niklas; Protopopova, Vera; Wilson, Benjamin; Koskinen, Jari; Laurila, Tomi2017 in Journal of Physical Chemistry C (AMER CHEMICAL SOC)ISSN: 1932-7447Application-Specific Catalyst Layers Pt-Containing Carbon Nanofibers for Hydrogen Peroxide Detection
Laurila, Tomi; Sainio, Sami; Jiang, Hua; Isoaho, Noora; Koehne, Jessica; Etula, Jarkko; Koskinen, Jari; Meyyappan, M.2017 in ACS Omega (American Chemical Society)ISSN: 2470-1343Electron transport determines the electrochemical properties of tetrahedral amorphous carbon (ta-C) thins films
Palomäki, Tommi; Wester, Niklas; Caro, Miguel A.; Sainio, Sami; Protopopova, Vera; Koskinen, Jari; Laurila, Tomi2017 in Electrochimica Acta (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0013-4686Nanodiamonds on tetrahedral amorphous carbon significantly enhance dopamine detection and cell viability
Peltola, Emilia; Wester, Niklas; Holt, Katherine B.; Johansson, Leena-Sisko; Koskinen, Jari; Myllymäki, Vesa; Laurila, Tomi2017 in BIOSENSORS AND BIOELECTRONICS (ELSEVIER ADVANCED TECHNOLOGY)ISSN: 0956-5663Partially Reduced Graphene Oxide Modified Tetrahedral Amorphous Carbon Thin-Film Electrodes as a Platform for Nanomolar Detection of Dopamine
Wester, Niklas; Sainio, Sami; Palomäki, Tommi; Nordlund, Dennis; Singh, Vivek; Johansson, Leena-Sisko; Koskinen, Jari; Laurila, Tomi2017 in Journal of Physical Chemistry C (AMER CHEMICAL SOC)ISSN: 1932-7447Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system
Baheti, Varun A.; Islam, Sarfaraj; Kumar, Praveen; Ravi, Raju; Narayanan, Ramesh; Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paul, Aloke2016 in PHILOSOPHICAL MAGAZINE (Taylor and Francis Ltd.)ISSN: 1478-6435Accurate schemes for calculation of thermodynamic properties of liquid mixtures from molecular dynamics simulations
Caro, Miguel A.; Laurila, Tomi; Lopez-Acevedo, Olga2016 in JOURNAL OF CHEMICAL PHYSICS (AMER INST PHYSICS)ISSN: 0021-9606Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Dong, Hongqun; Vuorinen, Vesa; Liu, Xuwen; Laurila, Tomi; Li, Jue; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2016 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Understanding the Growth of Interfacial Reaction Product Layers between Dissimilar Materials
Laurila, Tomi; Paul, Aloke2016 in CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES (Taylor and Francis Ltd.)ISSN: 1040-8436The role of extra carbon source during the pre-annealing stage in the growth of carbon nanofibers
Laurila, Tomi; Sainio, Sami; Jiang, Hua; Koskinen, Jari; Koehne, Jessica; Meyyappan, Meyya2016 in CARBON (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0008-6223Characterization and Electrochemical Properties of Oxygenated Amorphous Carbon (a-C) Films
Palomäki, Tommi; Wester, Niklas; Johansson, Leena-Sisko; Laitinen, Mikko; Jiang, Hua; Arstila, Kai; Sajavaara, Timo; Han, Jeon G.; Koskinen, Jari; Laurila, Tomi2016 in Electrochimica Acta (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0013-4686Correlation between sp3-to-sp2 Ratio and Surface Oxygen Functionalities in Tetrahedral Amorphous Carbon (ta-C) Thin Film Electrodes and Implications of Their Electrochemical Properties
Sainio, S.; Nordlund, D.; Caro , M.A.; Gandhiraman, R.; Koehne, J.; Wester, N.; Koskinen, J.; Meyyappan, M.; Laurila, T.2016 in Journal of Physical Chemistry C (AMER CHEMICAL SOC)ISSN: 1932-7447Structural morphology of carbon nanofibers grown on different substrates
Sainio, Sami; Jiang, Hua; Caro, Miguel A.; Koehne, Jessica; Lopez-Acevedo, Olga; Koskinen, Jari; Meyyappan, Meyya; Laurila, Tomi2016 in CARBON (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0008-6223What Does Nitric Acid Really Do to Carbon Nanofibers?
Sainio, Sami; Nordlund, Dennis; Gandhiraman, Ramprasad; Jiang, Hua; Koehne, Jessica; Koskinen, Jari; Meyyappan, M.; Laurila, Tomi2016 in Journal of Physical Chemistry C (AMER CHEMICAL SOC)ISSN: 1932-7447Piezoelectric coefficients and spontaneous polarization of ScAlN
Caro, Miguel; Zhang, Siyuan; Riekkinen, Tommi; Ylilammi, Markku; Moram, Michelle A.; Lopez-Acevedo, Olga; Molarius, Jyrki; Laurila, Tomi2015 in JOURNAL OF PHYSICS: CONDENSED MATTER (IOP PUBLISHING LTD)ISSN: 0953-8984Corrigendum to “Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies” [Carbon 77 (2014) 1168–1182]
Caro, Miguel A.; Zoubkoff, Remi; Lopez-Acevedo, Olga; Laurila, Tomi2015 in CARBON (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0008-6223Energy band alignment and electronic states of amorphous carbon surfaces in vacuo and in aqueous environment
Caro, Miguel A.; Määttä, Jukka; Lopez-Acevedo, Olga; Laurila, Tomi2015 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Cycle aging of commercial NMC/graphite pouch cells at different temperatures
Jalkanen, K.; Karppinen, J.; Skogström, L.; Laurila, T.; Nisula, M.; Vuorilehto, K.2015 in APPLIED ENERGY (ELSEVIER SCI LTD)ISSN: 0306-2619Glutamate detection by amino functionalized tetrahedral amorphous carbon surfaces
Kaivosoja, Emilia; Tujunen, Noora; Jokinen, Ville; Protopopova, Vera; Heinilehto, Santtu; Koskinen, Jari; Laurila, Tomi2015 in TALANTA (Elsevier Science B.V.)ISSN: 0039-9140Hybrid carbon nanomaterials for electrochemical detection of biomolecules
Laurila, Tomi2015 in PHYSICA SCRIPTA (IOP Publishing Ltd.)ISSN: 0031-8949Multi-walled carbon nanotubes (MWCNTs) grown directly on tetrahedral amorphous carbon (ta-C): An interfacial study
Laurila, Tomi; Sainio, Sami; Jiang, Hua; Palomäki, Tommi; Pitkänen, Olli; Kordas, Krisztian; Koskinen, Jari2015 in DIAMOND AND RELATED MATERIALS (Elsevier BV)ISSN: 0925-9635Trifluoroacetylazobenzene for optical and electrochemical detection of amines
Lin, Jhih Fong; Kukkola, Jarmo; Sipola, Teemu; Raut, Dilip; Samikannu, Ajaikumar; Mikkola, Jyri Pekka; Mohl, Melinda; Toth, Geza; Su, Wei Fang; Laurila, Tomi; Kordas, Krisztian2015 in JOURNAL OF MATERIALS CHEMISTRY. A (ROYAL SOC CHEMISTRY)ISSN: 2050-7488Electrochemical reactions of catechol, methylcatechol and dopamine at tetrahedral amorphous carbon (ta-C) thin film electrodes
Palomäki, Tommi; Chumillas, Sara; Sainio, Sami; Protopopova, Vera; Kauppila, Minna; Koskinen, Jari; Climent, Victor; Feliu, Juan M; Laurila, Tomi2015 in DIAMOND AND RELATED MATERIALS (Elsevier BV)ISSN: 0925-9635Ultrathin undoped tetrahedral amorphous carbon films: thickness dependence of electronic structure and implications to electrochemical behavior
Protopopova, Vera S.; Wester, Niklas; Caro, Miguel A.; Gabdullin, Pavel G.; Palomäki, Tommi; Laurila, Tomi; Koskinen, Jari2015 in PHYSICAL CHEMISTRY CHEMICAL PHYSICS (ROYAL SOC CHEMISTRY)ISSN: 1463-9076Ultrathin undoped tetrahedral amorphous carbon films: The role of the underlying titanium layer on the electronic structure
Protopopova, Vera; Iyer, Ajai; Wester, Niklas; Kondrateva, Anastasia; Sainio, Sami; Palomäki, Tommi; Laurila, Tomi; Mishin, Maxim; Koskinen, Jari2015 in DIAMOND AND RELATED MATERIALS (Elsevier BV)ISSN: 0925-9635Integrated carbon nanostructures for detection of neurotransmitters
Sainio, Sami; Palomäki, Tommi; Tujunen, Noora; Protopopova, Vera; Koehne, Jessica; Kordas, Krisztian; Koskinen, Jari; Meyyappan, M.; Laurila, Tomi2015 in MOLECULAR NEUROBIOLOGY (Humana Press)ISSN: 0893-7648Carbon nanotube (CNT) forest grown on diamond-like carbon (DLC) thin films significantly improves electrochemical sensitivity and selectivity towards dopamine
Sainio, Sami; Palomäki, Tommi; Rhode, Sneha; Kauppila, Minna; Lahtinen, Jouko; Pitkänen, Olli; Selkälä, Tuula; Toth, Geza; Kordas, Krisztian; Moram, Michelle; Koskinen, Jari; Laurila, Tomi2015 in SENSORS AND ACTUATORS B: CHEMICAL (Elsevier)ISSN: 0925-4005Electrochemical detection of hydrogen peroxide on platinum-containing tetrahedral amorphous carbon sensors and evaluation of their biofouling properties
Tujunen, Noora; Kaivosoja, Emilia; Protopopova, Vera; Valle-Delgado, Juan José; Österberg, Monika; Koskinen, Jari; Laurila, Tomi2015 in MATERIALS SCIENCE AND ENGINEERING C: MATERIALS FOR BIOLOGICAL APPLICATIONS (Elsevier Science B.V.)ISSN: 0928-4931Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Jalkanen, Kirsi; Vuorilehto, Kai; Skogström, Lasse; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XThermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Abdul-Quadir, Yasir; Laurila, Tomi; Karppinen, Juha; Paulasto-Kröckel, Mervi2014 in INTERNATIONAL JOURNAL OF ENERGY RESEARCH (WILEY-BLACKWELL)ISSN: 0363-907XAtomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory Properties and simulation strategies
Caro, Miguel A.; Zoubkoff, Remi; Lopez-Acevedo, Olga; Laurila, Tomi2014 in CARBON (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0008-6223Thermodynamic reassessment of Au-Cu-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2014 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Carbon thin films as electrode material in neural sensing
Kaivosoja, Emilia; Sainio, Sami; Lyytinen, Jussi; Palomäki, Tommi; Laurila, Tomi; Kim, Sung I.; Han, Jeon G.; Koskinen, Jari2014 in SURFACE AND COATINGS TECHNOLOGY (Elsevier Science)ISSN: 0257-8972Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post treatments and the use of Ti adhesion layer
Laurila, Tomi; Rautiainen, Antti; Sintonen, Sakari; Jiang, Hua; Kaivosoja, Emilia; Koskinen, Jari2014 in MATERIALS SCIENCE AND ENGINEERING C: MATERIALS FOR BIOLOGICAL APPLICATIONS (Elsevier Science B.V.)ISSN: 0928-4931New electrochemically improved tetrahedral amorphous carbon films for biological applications
Laurila, Tomi; Protopopova, Vera; Rhode, Sneha; Sainio, Sami; Palomäki, Tommi; Moram, Michelle; Feliu, Juan; Koskinen, Jari2014 in DIAMOND AND RELATED MATERIALS (Elsevier BV)ISSN: 0925-9635Phase evolution in the AuCu/Sn system by solid-state reactive diffusion
Santra, Sangeeta; Islam, Sarfaraj; Ravi, Raju; Vuorinen, Vesa; Laurila, Tomi; Paul, Aloke2014 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions
Santra, Sangeeta; Dong, Hongqun; Laurila, Tomi; Paul, Aloke2014 in PROCEEDINGS OF THE ROYAL SOCIETY A: MATHEMATICAL PHYSICAL AND ENGINEERING SCIENCES (ROYAL SOC)ISSN: 1364-5021Thermodynamic reassessment of Au-Ni-Sn ternary system
Dong, Hongqun; Vuorinen, Vesa; Laurila, Tomi; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Thermodynamic modeling of Au-Ce-Sn ternary system
Dong, Hongqun; Tao, Xiaoma.; Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Laurila, Tomi; Karppinen, Juha; Li, Jue; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2013 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522Thermodynamic assessment of Au-Ho and Au-Tm binary systems
Dong, Hongqun; Tao, Xiaoma; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 in CALPHAD: COMPUTER COUPLING OF PHASE DIAGRAMS AND THERMOCHEMISTRY (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0364-5916The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
Karppinen, J. S.; Laurila, T.; Mattila, T. T.; Paulasto-KröCkel, M.2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Karppinen, Juha S.; Laurila, Tomi; Mattila, Toni T.; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Interfacial reactions between SnAg1.0Ti and Ni metallization
Laurila, Tomi; Dong, Hongqun; Vuorinen, Vesa2012 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Li, Jue; Paulasto-Kröckel, Mervi2012 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Comments on “Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints
Paul, Aloke; Laurila, Tomi2012 in INTERMETALLICS (Elsevier Limited)ISSN: 0966-9795Effect of Ti on the interfacial reaction between Sn and Cu
Vuorinen, Vesa; Dong, Hongqun; Laurila, Tomi2012 in JOURNAL OF MATERIALS SCIENCE: MATERIALS IN ELECTRONICS (Springer New York)ISSN: 0957-4522Diffusion and growth of the µ phase (Ni6Nb7) in the Ni-Nb system
Balam, S.S.K.; Dong, Hongqun; Laurila, Tomi; Vuorinen, Vesa; Paul, Aloke2011 in METALLURGICAL AND MATERIALS TRANSACTIONS A: PHYSICAL METALLURGY AND MATERIALS SCIENCE (Springer Boston)ISSN: 1073-5623Thermodynamic assessment of Au-La and Au-Er binary systems
Dong, Hongqun; Tao, X.M.; Liu, H.S.; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ALLOYS AND COMPOUNDS (Elsevier Science)ISSN: 0925-8388Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Laurila, Tomi; Karppinen, Juha; Vuorinen, Vesa; Paul, A.; Paulasto-Kröckel, Mervi2011 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Study of ghrowth of Nb3Sn superconductor in (Cu-Sn)/Nb diffusion couple
Kumar, A.K.; Laurila, Tomi; Vuorinen, V.; Paul, A.2010 in DEFECT AND DIFFUSION FORUM (Trans Tech Publications)ISSN: 1012-0386Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Laurila, T.; Vuorinen, V.; Paulasto-Kröckel, M.2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XDiffusion and growth mechanism of Nb3 Sn superconductor grown by bronze technique
Laurila, T.; Vuorinen, V.; Kumar, A. K.; Paul, A.2010 in APPLIED PHYSICS LETTERS (AMER INST PHYSICS)ISSN: 0003-6951Simulation of dynamic recrystallization in solder interconnections during thermal cycling
Li, J.; Xu, H.; Mattila, T.T.; Kivilahti, J.K.; Laurila, T.; Paulasto-Kröckel, M.2010 in COMPUTATIONAL MATERIALS SCIENCE (Elsevier)ISSN: 0927-0256Determination of diffusion parameters and activation energy of diffusion in V3Si phase with A15 crystal structure
Kumar, A. K.; Laurila, T.; Vuorinen, V.; Paul, A.2009 in SCRIPTA MATERIALIA (Elsevier Limited)ISSN: 1359-6462Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solders
Laurila, Tomi; Vuorinen, Vesa2009 in MATERIALS (MDPI AG)Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
Laurila, Tomi; Hurtig, Johannes; Vuorinen, Vesa; Kivilahti, Jorma2009 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Reliability of lead-ree solder interconnections in thermal and power cycling tests
Li, Jue; Karppinen, Juha; Laurila, Tomi; Kivilahti, Jorma Kalevi2009 in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1521-3331Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Li, Jue; Karppinen, Juha; Laurila, Tomi; Kivilahti, Jorma2009 in IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES (Institute of Electrical and Electronics Engineers Inc.)ISSN: 1521-3331Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
Vuorinen, Vesa; Yu, Hao; Laurila, Tomi; Kivilahti, Jorma2008 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
Laurila, Tomi; Mattila, Toni; Vuorinen, Vesa; Karppinen, Juha; Li, Jue; Sippola, Mika; Kivilahti, Jorma2007 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Solid-state reactions between Cu(Ni) alloys and Sn
Vuorinen, Vesa; Laurila, Tomi; Mattila, Toni; Heikinheimo, Erkki; Kivilahti, Jorma2007 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Reactive blending approach to modify spin-coated epoxy film Part II. Crosslinking kinetics
Turunen, Markus P.K.; Laurila, T.; Kivilahti, J.K.2006 in JOURNAL OF APPLIED POLYMER SCIENCE (Wiley-Blackwell)ISSN: 0021-8995Reactive blending approach to modify spin-coated epoxy film Part I. Synthesis and characterization of star-shaped poly(e-caprolactone)
Turunen, Markus P.K.; Laurila, T.; Kivilahti, J.K.2006 in JOURNAL OF APPLIED POLYMER SCIENCE (Wiley-Blackwell)ISSN: 0021-8995Phase formation between Lead-free SnAgCu Solder and Ni(P)/Au Finish on PWB
Vuorinen, Vesa; Laurila, T.; Yu, H.; Kivilahti, J.K.2006 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes
Vuorinen, V.; Laurila, T.; Yu, H.; Kivilahti, J. K.2006 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Interfacial reactions between lead-free solders and common base materials
Laurila, Tomi; Vuorinen, Vesa; Kivilahti, Jorma2005 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XAnalysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders
Laurila, T.; Vuorinen, V.; Mattila, T.; Kivilahti, J. K.2005 in JOURNAL OF ELECTRONIC MATERIALS (SPRINGER)ISSN: 0361-5235Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
Waris, Tuomas F.; Turunen, Markus P.K; Laurila, Tomi; Kivilahti, Jorma K.2005 in Microelectronics Reliability (PERGAMON-ELSEVIER SCIENCE LTD)ISSN: 0026-2714Analyses of interfacial reactions at different levels of interconnection
Laurila, T.; Vuorinen, V.; Kivilahti, J. K.2004 in MATERIALS SCIENCE IN SEMICONDUCTOR PROCESSING (Elsevier Limited)ISSN: 1369-8001Interfacial reactions in the Si/TaC/Cu system
Laurila, Tomi; Molarius, J.; Kivilahti, J.K.2004 in MICROELECTRONIC ENGINEERING (Elsevier)ISSN: 0167-9317Reactive Phase Formation in Thin Film Metal/Metal and Metal/Silicon Diffusion Couples
Laurila, Tomi; Molarius, Jyrki2003 in CRITICAL REVIEWS IN SOLID STATE AND MATERIALS SCIENCES (Taylor and Francis Ltd.)ISSN: 1040-8436Effect of oxygen on theRreactions in Si/Ta/Cu and Si/TaC/Cu Systems
Laurila, Tomi; Zeng, Kejun; Molarius, Jyrki; Riekkinen, Tommi; Suni, Ilkka; Kivilahti, Jorma K.2002 in MICROELECTRONIC ENGINEERING (Elsevier)Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems
Laurila, T.; Zeng, K.; Molarius, J.; Riekkinen, T.; Suni, I.; Kivilahti, J. K.2002 in MICROELECTRONIC ENGINEERING (Elsevier)ISSN: 0167-9317Tantalum carbide and nitride diffusion barriers for Cu metallisation
Laurila, T.; Zeng, K.; Kivilahti, J. K.; Molarius, J.; Riekkinen, T.; Suni, I.2002 in MICROELECTRONIC ENGINEERING (Elsevier)ISSN: 0167-9317Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system
Laurila, Tomi; Zeng, Kejun; Kivilahti, Jorma K.; Molarius, Jyrki; Suni, Ilkka2002 in APPLIED PHYSICS LETTERS (AMERICAN INSTITUTE OF PHYSICS)ISSN: 0003-6951TaC as a diffusion barrier between Si and Cu
Laurila, Tomi; Zeng, Kejun; Kivilahti, Jorma K.; Molarius, Jyrki; Suni, Iikka2002 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Reactive sputter deposition and properties of TaxN thin films
Riekkinen, T.; Molarius, J.; Laurila, T.; Nurmela, A.; Suni, I.; Kivilahti, J. K.2002 in MICROELECTRONIC ENGINEERING (Elsevier)ISSN: 0167-9317Evaluation of the surface free energy of spin-coated photodefinable epoxy
Turunen, Markus P.K.; Laurila, Tomi; Kivilahti, Jorma K.2002 in JOURNAL OF POLYMER SCIENCE PART B: POLYMER PHYSICS (John Wiley and Sons Inc.)ISSN: 0887-6266Effect on Oxygen on the Reactions in the Si/Ta/Cu metallization System
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.K.2001 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)Effect of oxygen on the reactions in the Si/Ta/Cu metallization system
Laurila, Tomi; Zeng, Kejun; Kivilahti, Jorma K.; Molarius, Jyriki; Suni, Ilkka2001 in JOURNAL OF MATERIALS RESEARCH (MATERIALS RESEARCH SOCIETY)ISSN: 0884-2914Failure mechanism of Ta diffusion barrier between Cu and Si
Laurila, Tomi; Zeng, Kejun; Kivilahti, Jorma K.; Molarius, Jyrki; Suni, Ilkka2000 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)ISSN: 0021-8979Chemical stability of Ta diffusion barrier between Cu and Si
Laurila, T.; Zeng, K.; Kivilahti, J. K.; Molarius, J.; Suni, I.2000 in THIN SOLID FILMS (Elsevier Science)ISSN: 0040-6090Failure Mechanism of Ta Diffusion Between Cu and Si
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.2000 in JOURNAL OF APPLIED PHYSICS (AIP Publishing)Review article, Literature review, Systematic reviewHybrid carbon based nanomaterials for electrochemical detection of biomolecules
Laurila, Tomi; Sainio, Sami; Caro, Miguel A.2017 in PROGRESS IN MATERIALS SCIENCE (Elsevier Limited)ISSN: 0079-6425Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Laurila, Tomi; Vuorinen, Vesa; Paulasto-Kröckel, Mervi2010 in MATERIALS SCIENCE AND ENGINEERING R: REPORTS (Elsevier BV)ISSN: 0927-796XBook section, Chapters in research booksThermodynamic-Kinetic method on Microstructural Evolutions in Electronics
Laurila, Tomi; Aloke, Paul; Dong, Hongqun; Vuorinen, Vesa2017 ISBN: 978-0-12-804548-0Types of Defects, Driving Forces and Diffusion in Solids
Paul, Aloke; Laurila, Tomi; Divinsky, Sergiy2017 ISBN: 978-0-12-804287-8Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 ISBN: 978-953-51-062-4Reliability of Electronic Assemblies Under Mechanical Shock Loading
Mattila, Toni Tuomas; Laurila, Tomi Taneli; Vuorinen, Vesa; Kivilahti, Jorma Kalevi2011 Metallurgical factors behind the reliability of high density lead-free interconnections
Mattila, Toni; Laurila, Tomi; Kivilahti, Jorma2007 ”Reliability of Electronic Assemblies Under Mechanical Shock Loading
Mattila, T.T.; Laurila, T.; Kivilahti, Jorma K.2007 Effect factors behind the reliability of high density lead-free interconnections
Mattila, Toni; Laurila, Tomi; Kivilahti, Jorma2007 Conference proceedingsNano carbon hybride thin films as electrode material in neural sensing
Wester, Niklas; Palomäki, Tommi; Singh, Vivek; Protopopova, Vera; Sainio, Sami; Tujunen, Noora; Laurila, Tomi; Koskinen, Jari2016 Energy band alignment at amorphous carbon/water interfaces
Caro, Miguel; Määttä, Jukka; Lopez-Acevedo, Olga; Laurila, Tomi2015 Configurational effects on the piezoelectric properties of ScAlN
Zhang, Siyan; Laurila, Tomi; Lopez-Acevedo, Olga2015 Understanding the effect of electromigration on the growth of interfacial reaction layers in Cu-Sn and Cu-Ni-Sn systems
Laurila, Tomi; Paul, Aloke2014 ISBN: 9781479940264Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7ISSN: 1557-170XThe effect of self-assembled monolayers on glutamate oxidase immobilisation
Kaivosoja, Emilia; Jokinen, Ville; Tujunen, Noora; Laurila, Tomi2013 Carbon thin films as electrode material in neural sensing
Sainio, Sami; Lyytinen, Jussi; Laurila, Tomi; Kim, Sun; Han, Jeon; Koskinen, Jari2013 Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-4577-0105-4Wireless Monitoring Sensor System for Tracking the Hydrothermal Behaviour and Deterioration of Building Structures
Mäkitalo, Mika; Al-Neshawy, Fahim; Laurila, Tomi2011 ISBN: 978-82-8208-025-5ISSN: 0800-6377Monitoring System for Tracking the Hydrothermal Behaviour of the Building Structures
Mäkitalo, Mika; Al-Neshawy, Fahim; Laurila, Tomi2011 ISBN: 978-951-758-531-6ISSN: 0356-9403The use of ICT for monitoring the hygrothermal behavior of building structures
Al-Neshawy, F.; Laurila, Tomi; Vuorinen, V.; Mäkitalo, M.2010 Study on the growth of Nb3Sn superconductor in Cu(Sn)/Nb diffusion couple
Kumar, A. K.; Laurila, T.; Vuorinen, V.; Paul, A.2010 in Defect and Diffusion Forum (Trans Tech Publications Ltd.)ISBN: 3908451809ISSN: 1012-0386On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.2009 ISBN: 9781424451005A comparative study of power cycling and thermal shock tests
Karppinen, J.; Laurila, T.; Kivilahti, J.K.2007 ISBN: 1424405521The Role of Intermetallics in The Integrity of Solder Interconnections
Mattila, T.; Laurila, T.; Kivilahti, Jorma K.2006 Analyses of Interfacial Reactions at Different Levels of Interconnections
Laurila, Tomi; Kivilahti, Jorma2004 Reliability of tantalum based diffusion barriers between Cu and Si
Laurila, T.; Zeng, K.; Seppälä, A.; Molarius, J.; Suni, I.; Kivilahti, J. K.2000 Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization
Molarius, Jyrki; Laurila, Tomi; Riekkinen, Tommi; Zeng, Kejun; Niskanen, Antti; Leskelä, Markku; Suni, Ilkka; Kivilahti, Jorma K.2000 Chemical stability of tantalum as diffusion barrier between copper and silicon
Laurila, T.; Zeng, K.; Molarius, J.M.T.; Suni, I.; Kivilahti, J.1999 R.F.-sputtered tantalum-based diffusion barriers between copper and silicon
Molarius, J.M.T.; Laurila, T.; Zeng, K.; Suni, I.; Kivilahti, J.K.1999 Scientific books (monographs)
BookThermodynamics, Diffusion And The Kirkendall Effect In Solids
Paul, Aloke; Laurila, Tomi; Vuorinen, Vesa; Divinsky, Sergiy2014 ISBN: 978-3-3190-7460-3Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsEffects of local composition fluctuations in nitride alloys: Piezoelectric and electronic properties
Caro, Miguel; Schulz, Stefan; Zhang, Siyun; Laurila, Tomi; "O'Reilly", Eoin2015 Published development or research reportReactive blending approach to modify spin-coated epoxy film
Turunen, Markus P.K; Laurila, Tomi; Solehmainen, Kimmo; Kivilahti, Jorma K.2004 Stability of TaC Diffusion BarrierBetween Si and Cu
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.K.2001 Tantalm baseddiffusion barriers for copper metallization
Laurila, T.; Zeng, K.; Kivilahti, J.1999 Interfacial Reactions in Thin Film Systems
Zeng, K.; Laurila, T.; Kivilahti, J.1999 Corrigendum to "Carbon nanotube (CNT) forest on diamond-like carbon (DLC) electrode improves electrochemical sensitivity towards dopamine by two orders of magnitude" [Sens. Actuators B 211 (2015) 177-186]
Sainio, Sami; Palomäki, T.; Rhode, S.; Kauppila, M.; Pitkänen, O.; Selkälä, T.; Toth, G.; Kordas, K.; Moram, M.; Koskinen, J.; Laurila, Tomi2016 Erratum Piezoelectric coefficients and spontaneous polarization of ScAlN (Journal of Physics: Condensed Matter (2015) 27 (245901))
Caro, Miguel A.; Zhang, Siyuan; Ylilammi, Markku; Riekkinen, Tommi; Moram, Michelle A.; Lopez-Acevedo, Olga; Molarius, Jyrki; Laurila, Tomi2015 in Journal of physics: condensed matter (SPRINGER)ISSN: 0953-8984Erratum Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies (Carbon (2014) 77 (1168-1182))
Caro Bayo, Miguel; Zoubkoff, Rémi; Lopez-Acevedo, Olga; Laurila, Tomi2015
Doping as a means to probe the potential dependence of dopamine adsorption on carbon-based surfaces A first-principles study
Redox Potentials from Ab Initio Molecular Dynamics and Explicit Entropy Calculations Application to Transition Metals in Aqueous Solution
Amorphous carbon thin film electrodes with intrinsic Pt-gradient for hydrogen peroxide detection
Carbon Nanostructure Based Platform for Enzymatic Glutamate Biosensors
Application-Specific Catalyst Layers Pt-Containing Carbon Nanofibers for Hydrogen Peroxide Detection
Electron transport determines the electrochemical properties of tetrahedral amorphous carbon (ta-C) thins films
Nanodiamonds on tetrahedral amorphous carbon significantly enhance dopamine detection and cell viability
Partially Reduced Graphene Oxide Modified Tetrahedral Amorphous Carbon Thin-Film Electrodes as a Platform for Nanomolar Detection of Dopamine
Effect of Ni content on the diffusion-controlled growth of the product phases in the Cu(Ni)-Sn system
Accurate schemes for calculation of thermodynamic properties of liquid mixtures from molecular dynamics simulations
Microstructural evolution and mechanical properties of Au-20wt.%Sn|Ni interconnection
Microstructural Evolution and Mechanical Properties in (AuSn)eut-Cu Interconnections
Understanding the Growth of Interfacial Reaction Product Layers between Dissimilar Materials
The role of extra carbon source during the pre-annealing stage in the growth of carbon nanofibers
Characterization and Electrochemical Properties of Oxygenated Amorphous Carbon (a-C) Films
Correlation between sp3-to-sp2 Ratio and Surface Oxygen Functionalities in Tetrahedral Amorphous Carbon (ta-C) Thin Film Electrodes and Implications of Their Electrochemical Properties
Structural morphology of carbon nanofibers grown on different substrates
What Does Nitric Acid Really Do to Carbon Nanofibers?
Piezoelectric coefficients and spontaneous polarization of ScAlN
Corrigendum to “Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies” [Carbon 77 (2014) 1168–1182]
Energy band alignment and electronic states of amorphous carbon surfaces in vacuo and in aqueous environment
Cycle aging of commercial NMC/graphite pouch cells at different temperatures
Glutamate detection by amino functionalized tetrahedral amorphous carbon surfaces
Hybrid carbon nanomaterials for electrochemical detection of biomolecules
Multi-walled carbon nanotubes (MWCNTs) grown directly on tetrahedral amorphous carbon (ta-C): An interfacial study
Trifluoroacetylazobenzene for optical and electrochemical detection of amines
Electrochemical reactions of catechol, methylcatechol and dopamine at tetrahedral amorphous carbon (ta-C) thin film electrodes
Ultrathin undoped tetrahedral amorphous carbon films: thickness dependence of electronic structure and implications to electrochemical behavior
Ultrathin undoped tetrahedral amorphous carbon films: The role of the underlying titanium layer on the electronic structure
Integrated carbon nanostructures for detection of neurotransmitters
Carbon nanotube (CNT) forest grown on diamond-like carbon (DLC) thin films significantly improves electrochemical sensitivity and selectivity towards dopamine
Electrochemical detection of hydrogen peroxide on platinum-containing tetrahedral amorphous carbon sensors and evaluation of their biofouling properties
Heat generation in high power prismatic Li-ion battery cell with LiMnNiCoO2 cathode material
Thermal simulation of high-power Li-ion battery with LiMn1/3Ni1/3Co1/3O2 cathode on cell and module levels
Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory Properties and simulation strategies
Thermodynamic reassessment of Au-Cu-Sn ternary system
Carbon thin films as electrode material in neural sensing
Diamond-like carbon (DLC) thin film bioelectrodes: Effect of thermal post treatments and the use of Ti adhesion layer
New electrochemically improved tetrahedral amorphous carbon films for biological applications
Phase evolution in the AuCu/Sn system by solid-state reactive diffusion
Role of different factors affecting interdiffusion in Cu(Ga) and Cu(Si) solid solutions
Thermodynamic reassessment of Au-Ni-Sn ternary system
Thermodynamic modeling of Au-Ce-Sn ternary system
Effect of isothermal annealing and electromigration pre-treatments on the reliability of solder interconnections under vibration loading
Thermodynamic assessment of Au-Ho and Au-Tm binary systems
The combined effect of shock impacts and operational power cycles on the reliability of handheld device component board interconnections
“The combined effect of shock impacts and operational power cycles on the reliability of a high-density mobile device component board”
Interfacial reactions between SnAg1.0Ti and Ni metallization
Effect of Isothermal Aging and Electromigration on the Microstructural Evolution of Solder Interconnections During Thermomechanical Loading
Comments on “Effects of current density on the formation and microstructure of Sn-9Zn, Sn-8Zn-3Bi and Sn-3Ag-0.5Cu solder joints
Effect of Ti on the interfacial reaction between Sn and Cu
Diffusion and growth of the µ phase (Ni6Nb7) in the Ni-Nb system
Thermodynamic assessment of Au-La and Au-Er binary systems
Effect of constant and cyclic current stressing on the evolution of intermetallic compound layers
Study of ghrowth of Nb3Sn superconductor in (Cu-Sn)/Nb diffusion couple
Impurity and alloying effects on interfacial reaction layers in Pb-free soldering
Diffusion and growth mechanism of Nb3 Sn superconductor grown by bronze technique
Simulation of dynamic recrystallization in solder interconnections during thermal cycling
Determination of diffusion parameters and activation energy of diffusion in V3Si phase with A15 crystal structure
Combined thermodynamic-kinetic analysis of the interfacial reactions between Ni metallization and various lead-free solders
Effect of Ag, Fe, Au and Ni on the growth kinetics of Sn-Cu intermetallic compound layers
Reliability of lead-ree solder interconnections in thermal and power cycling tests
Reliability of Lead-Free Solder Interconnections in Thermal and Power Cycling Tests
Formation of Intermetallic Compounds Between Liquid Sn and Various CuNix Metallizations
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests
Solid-state reactions between Cu(Ni) alloys and Sn
Reactive blending approach to modify spin-coated epoxy film Part II. Crosslinking kinetics
Reactive blending approach to modify spin-coated epoxy film Part I. Synthesis and characterization of star-shaped poly(e-caprolactone)
Phase formation between Lead-free SnAgCu Solder and Ni(P)/Au Finish on PWB
Phase formation between lead-free Sn-Ag-Cu solder and Ni(P)/Au finishes
Interfacial reactions between lead-free solders and common base materials
Analysis of the redeposition of AuSn4 on Ni/Au contact pads when using SnPbAg, SnAg, and SnAgCu solders
Evaluation of electrolessly deposited NiP integral resistors on flexible polyimide substrate
Analyses of interfacial reactions at different levels of interconnection
Interfacial reactions in the Si/TaC/Cu system
Reactive Phase Formation in Thin Film Metal/Metal and Metal/Silicon Diffusion Couples
Effect of oxygen on theRreactions in Si/Ta/Cu and Si/TaC/Cu Systems
Effect of oxygen on the reactions in Si/Ta/Cu and Si/TaC/Cu systems
Tantalum carbide and nitride diffusion barriers for Cu metallisation
Amorphous layer formation at the TaC/Cu interface in the Si/TaC/Cu metallization system
TaC as a diffusion barrier between Si and Cu
Reactive sputter deposition and properties of TaxN thin films
Evaluation of the surface free energy of spin-coated photodefinable epoxy
Effect on Oxygen on the Reactions in the Si/Ta/Cu metallization System
Effect of oxygen on the reactions in the Si/Ta/Cu metallization system
Failure mechanism of Ta diffusion barrier between Cu and Si
Chemical stability of Ta diffusion barrier between Cu and Si
Failure Mechanism of Ta Diffusion Between Cu and Si
Hybrid carbon based nanomaterials for electrochemical detection of biomolecules
Impurity and Alloying Effects on Reaction Layers in Lead-Free Soldering
Book section, Chapters in research booksThermodynamic-Kinetic method on Microstructural Evolutions in Electronics
Laurila, Tomi; Aloke, Paul; Dong, Hongqun; Vuorinen, Vesa2017 ISBN: 978-0-12-804548-0Types of Defects, Driving Forces and Diffusion in Solids
Paul, Aloke; Laurila, Tomi; Divinsky, Sergiy2017 ISBN: 978-0-12-804287-8Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Li, Jue; Laurila, Tomi; Mattila, Toni T.; Xu, Hongbo; Paulasto-Kröckel, Mervi2013 ISBN: 978-953-51-062-4Reliability of Electronic Assemblies Under Mechanical Shock Loading
Mattila, Toni Tuomas; Laurila, Tomi Taneli; Vuorinen, Vesa; Kivilahti, Jorma Kalevi2011 Metallurgical factors behind the reliability of high density lead-free interconnections
Mattila, Toni; Laurila, Tomi; Kivilahti, Jorma2007 ”Reliability of Electronic Assemblies Under Mechanical Shock Loading
Mattila, T.T.; Laurila, T.; Kivilahti, Jorma K.2007 Effect factors behind the reliability of high density lead-free interconnections
Mattila, Toni; Laurila, Tomi; Kivilahti, Jorma2007 Conference proceedingsNano carbon hybride thin films as electrode material in neural sensing
Wester, Niklas; Palomäki, Tommi; Singh, Vivek; Protopopova, Vera; Sainio, Sami; Tujunen, Noora; Laurila, Tomi; Koskinen, Jari2016 Energy band alignment at amorphous carbon/water interfaces
Caro, Miguel; Määttä, Jukka; Lopez-Acevedo, Olga; Laurila, Tomi2015 Configurational effects on the piezoelectric properties of ScAlN
Zhang, Siyan; Laurila, Tomi; Lopez-Acevedo, Olga2015 Understanding the effect of electromigration on the growth of interfacial reaction layers in Cu-Sn and Cu-Ni-Sn systems
Laurila, Tomi; Paul, Aloke2014 ISBN: 9781479940264Improving the function of dopamine electrodes with novel carbon materials
Kaivosoja, Emilia; Berg, Emilia; Rautiainen, Antti; Palomäki, Tommi; Koskinen, Jari; Paulasto-Kröckel, Mervi; Laurila, Tomi2013 in IEEE Engineering in Medicine and Biology Society Conference Proceedings (IEEE)ISBN: 978-1-4577-0216-7ISSN: 1557-170XThe effect of self-assembled monolayers on glutamate oxidase immobilisation
Kaivosoja, Emilia; Jokinen, Ville; Tujunen, Noora; Laurila, Tomi2013 Carbon thin films as electrode material in neural sensing
Sainio, Sami; Lyytinen, Jussi; Laurila, Tomi; Kim, Sun; Han, Jeon; Koskinen, Jari2013 Finite element modeling for reliability assessment of solder interconnections in a power transistor
Li, Jue; Karppinen, Juha; Laurila, Tomi; Vuorinen, Vesa; Paulasto -Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Vuorinen, Vesa; Dong, Hongqun; Xu, Hongbo; Vähänen, Sami; Suni, Tommi; Laurila, Tomi; Paulasto-Kröckel, Mervi2012 ISBN: 978-1-4673-4645-0Thermal Investigation of a Battery Module for Work Machines
Abdul-Quadir, Yasir; Heikkilä, Perttu; Lehmuspelto, Teemu; Karppinen, Juha; Laurila, Tomi; Paulasto-Kröckel, Mervi2011 ISBN: 978-1-4577-0105-4Wireless Monitoring Sensor System for Tracking the Hydrothermal Behaviour and Deterioration of Building Structures
Mäkitalo, Mika; Al-Neshawy, Fahim; Laurila, Tomi2011 ISBN: 978-82-8208-025-5ISSN: 0800-6377Monitoring System for Tracking the Hydrothermal Behaviour of the Building Structures
Mäkitalo, Mika; Al-Neshawy, Fahim; Laurila, Tomi2011 ISBN: 978-951-758-531-6ISSN: 0356-9403The use of ICT for monitoring the hygrothermal behavior of building structures
Al-Neshawy, F.; Laurila, Tomi; Vuorinen, V.; Mäkitalo, M.2010 Study on the growth of Nb3Sn superconductor in Cu(Sn)/Nb diffusion couple
Kumar, A. K.; Laurila, T.; Vuorinen, V.; Paul, A.2010 in Defect and Diffusion Forum (Trans Tech Publications Ltd.)ISBN: 3908451809ISSN: 1012-0386On the role of electromigration in power cycling tests
Vuorinen, Vesa; Karppinen, Juha; Laurila, Tomi; Paul, Aloke; Paulasto-Kröckel, Mervi2010 ISBN: 978-1-4244-8553-6Understanding materials compatibility issues in electronics packaging
Paulasto-Kröckel, M.; Laurila, T.; Vuorinen, V.2009 ISBN: 9781424451005A comparative study of power cycling and thermal shock tests
Karppinen, J.; Laurila, T.; Kivilahti, J.K.2007 ISBN: 1424405521The Role of Intermetallics in The Integrity of Solder Interconnections
Mattila, T.; Laurila, T.; Kivilahti, Jorma K.2006 Analyses of Interfacial Reactions at Different Levels of Interconnections
Laurila, Tomi; Kivilahti, Jorma2004 Reliability of tantalum based diffusion barriers between Cu and Si
Laurila, T.; Zeng, K.; Seppälä, A.; Molarius, J.; Suni, I.; Kivilahti, J. K.2000 Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization
Molarius, Jyrki; Laurila, Tomi; Riekkinen, Tommi; Zeng, Kejun; Niskanen, Antti; Leskelä, Markku; Suni, Ilkka; Kivilahti, Jorma K.2000 Chemical stability of tantalum as diffusion barrier between copper and silicon
Laurila, T.; Zeng, K.; Molarius, J.M.T.; Suni, I.; Kivilahti, J.1999 R.F.-sputtered tantalum-based diffusion barriers between copper and silicon
Molarius, J.M.T.; Laurila, T.; Zeng, K.; Suni, I.; Kivilahti, J.K.1999 Scientific books (monographs)
BookThermodynamics, Diffusion And The Kirkendall Effect In Solids
Paul, Aloke; Laurila, Tomi; Vuorinen, Vesa; Divinsky, Sergiy2014 ISBN: 978-3-3190-7460-3Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsEffects of local composition fluctuations in nitride alloys: Piezoelectric and electronic properties
Caro, Miguel; Schulz, Stefan; Zhang, Siyun; Laurila, Tomi; "O'Reilly", Eoin2015 Published development or research reportReactive blending approach to modify spin-coated epoxy film
Turunen, Markus P.K; Laurila, Tomi; Solehmainen, Kimmo; Kivilahti, Jorma K.2004 Stability of TaC Diffusion BarrierBetween Si and Cu
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.K.2001 Tantalm baseddiffusion barriers for copper metallization
Laurila, T.; Zeng, K.; Kivilahti, J.1999 Interfacial Reactions in Thin Film Systems
Zeng, K.; Laurila, T.; Kivilahti, J.1999 Corrigendum to "Carbon nanotube (CNT) forest on diamond-like carbon (DLC) electrode improves electrochemical sensitivity towards dopamine by two orders of magnitude" [Sens. Actuators B 211 (2015) 177-186]
Sainio, Sami; Palomäki, T.; Rhode, S.; Kauppila, M.; Pitkänen, O.; Selkälä, T.; Toth, G.; Kordas, K.; Moram, M.; Koskinen, J.; Laurila, Tomi2016 Erratum Piezoelectric coefficients and spontaneous polarization of ScAlN (Journal of Physics: Condensed Matter (2015) 27 (245901))
Caro, Miguel A.; Zhang, Siyuan; Ylilammi, Markku; Riekkinen, Tommi; Moram, Michelle A.; Lopez-Acevedo, Olga; Molarius, Jyrki; Laurila, Tomi2015 in Journal of physics: condensed matter (SPRINGER)ISSN: 0953-8984Erratum Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies (Carbon (2014) 77 (1168-1182))
Caro Bayo, Miguel; Zoubkoff, Rémi; Lopez-Acevedo, Olga; Laurila, Tomi2015
Thermodynamic-Kinetic method on Microstructural Evolutions in Electronics
Types of Defects, Driving Forces and Diffusion in Solids
Simulation of Dynamic Recrystallization in Solder Interconnections during Thermal Cycling
Reliability of Electronic Assemblies Under Mechanical Shock Loading
Metallurgical factors behind the reliability of high density lead-free interconnections
”Reliability of Electronic Assemblies Under Mechanical Shock Loading
Effect factors behind the reliability of high density lead-free interconnections
Nano carbon hybride thin films as electrode material in neural sensing
Energy band alignment at amorphous carbon/water interfaces
Configurational effects on the piezoelectric properties of ScAlN
Understanding the effect of electromigration on the growth of interfacial reaction layers in Cu-Sn and Cu-Ni-Sn systems
Improving the function of dopamine electrodes with novel carbon materials
The effect of self-assembled monolayers on glutamate oxidase immobilisation
Carbon thin films as electrode material in neural sensing
Finite element modeling for reliability assessment of solder interconnections in a power transistor
Analysis of microstructural evolution in SLID-bonding used for hermetic encapsulation of MEMS devices
Thermal Investigation of a Battery Module for Work Machines
Wireless Monitoring Sensor System for Tracking the Hydrothermal Behaviour and Deterioration of Building Structures
Monitoring System for Tracking the Hydrothermal Behaviour of the Building Structures
The use of ICT for monitoring the hygrothermal behavior of building structures
Study on the growth of Nb3Sn superconductor in Cu(Sn)/Nb diffusion couple
On the role of electromigration in power cycling tests
Understanding materials compatibility issues in electronics packaging
A comparative study of power cycling and thermal shock tests
The Role of Intermetallics in The Integrity of Solder Interconnections
Analyses of Interfacial Reactions at Different Levels of Interconnections
Reliability of tantalum based diffusion barriers between Cu and Si
Reactively sputtered Ta2N and TaN diffusion barriers for copper metallization
Chemical stability of tantalum as diffusion barrier between copper and silicon
R.F.-sputtered tantalum-based diffusion barriers between copper and silicon
Scientific books (monographs)
BookThermodynamics, Diffusion And The Kirkendall Effect In Solids
Paul, Aloke; Laurila, Tomi; Vuorinen, Vesa; Divinsky, Sergiy2014 ISBN: 978-3-3190-7460-3Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Laurila, Tomi; Vuorinen, Vesa; Turunen, Markus; Mattila, Toni T.; Paulasto-Kröckel, Mervi; Kivilahti, Jorma2012 ISBN: 978-1-4471-2470-2Publications intended for professional communities
Article in professional conference proceedingsEffects of local composition fluctuations in nitride alloys: Piezoelectric and electronic properties
Caro, Miguel; Schulz, Stefan; Zhang, Siyun; Laurila, Tomi; "O'Reilly", Eoin2015 Published development or research reportReactive blending approach to modify spin-coated epoxy film
Turunen, Markus P.K; Laurila, Tomi; Solehmainen, Kimmo; Kivilahti, Jorma K.2004 Stability of TaC Diffusion BarrierBetween Si and Cu
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.K.2001 Tantalm baseddiffusion barriers for copper metallization
Laurila, T.; Zeng, K.; Kivilahti, J.1999 Interfacial Reactions in Thin Film Systems
Zeng, K.; Laurila, T.; Kivilahti, J.1999 Corrigendum to "Carbon nanotube (CNT) forest on diamond-like carbon (DLC) electrode improves electrochemical sensitivity towards dopamine by two orders of magnitude" [Sens. Actuators B 211 (2015) 177-186]
Sainio, Sami; Palomäki, T.; Rhode, S.; Kauppila, M.; Pitkänen, O.; Selkälä, T.; Toth, G.; Kordas, K.; Moram, M.; Koskinen, J.; Laurila, Tomi2016 Erratum Piezoelectric coefficients and spontaneous polarization of ScAlN (Journal of Physics: Condensed Matter (2015) 27 (245901))
Caro, Miguel A.; Zhang, Siyuan; Ylilammi, Markku; Riekkinen, Tommi; Moram, Michelle A.; Lopez-Acevedo, Olga; Molarius, Jyrki; Laurila, Tomi2015 in Journal of physics: condensed matter (SPRINGER)ISSN: 0953-8984Erratum Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies (Carbon (2014) 77 (1168-1182))
Caro Bayo, Miguel; Zoubkoff, Rémi; Lopez-Acevedo, Olga; Laurila, Tomi2015
Thermodynamics, Diffusion And The Kirkendall Effect In Solids
Interfacial Compatibility in Microelectronics: Away From the Trial and Error Approach
Effects of local composition fluctuations in nitride alloys: Piezoelectric and electronic properties
Published development or research reportReactive blending approach to modify spin-coated epoxy film
Turunen, Markus P.K; Laurila, Tomi; Solehmainen, Kimmo; Kivilahti, Jorma K.2004 Stability of TaC Diffusion BarrierBetween Si and Cu
Laurila, T.; Zeng, K.; Molarius, J.; Suni, I.; Kivilahti, J.K.2001 Tantalm baseddiffusion barriers for copper metallization
Laurila, T.; Zeng, K.; Kivilahti, J.1999 Interfacial Reactions in Thin Film Systems
Zeng, K.; Laurila, T.; Kivilahti, J.1999 Corrigendum to "Carbon nanotube (CNT) forest on diamond-like carbon (DLC) electrode improves electrochemical sensitivity towards dopamine by two orders of magnitude" [Sens. Actuators B 211 (2015) 177-186]
Sainio, Sami; Palomäki, T.; Rhode, S.; Kauppila, M.; Pitkänen, O.; Selkälä, T.; Toth, G.; Kordas, K.; Moram, M.; Koskinen, J.; Laurila, Tomi2016 Erratum Piezoelectric coefficients and spontaneous polarization of ScAlN (Journal of Physics: Condensed Matter (2015) 27 (245901))
Caro, Miguel A.; Zhang, Siyuan; Ylilammi, Markku; Riekkinen, Tommi; Moram, Michelle A.; Lopez-Acevedo, Olga; Molarius, Jyrki; Laurila, Tomi2015 in Journal of physics: condensed matter (SPRINGER)ISSN: 0953-8984Erratum Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies (Carbon (2014) 77 (1168-1182))
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Corrigendum to "Carbon nanotube (CNT) forest on diamond-like carbon (DLC) electrode improves electrochemical sensitivity towards dopamine by two orders of magnitude" [Sens. Actuators B 211 (2015) 177-186]
Erratum Piezoelectric coefficients and spontaneous polarization of ScAlN (Journal of Physics: Condensed Matter (2015) 27 (245901))
Erratum Atomic and electronic structure of tetrahedral amorphous carbon surfaces from density functional theory: Properties and simulation strategies (Carbon (2014) 77 (1168-1182))
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Harris Jones
PHONE 412-268-4177 OFFICE GSIA - Tepper School of Business - Room 102 AREA OF EXPERTISE Business Management Communication EDUCATION University of Virginia - MBA - 1991 COURSES TAUGHT INTRO ENTREPRENRSHIP (70415) 2014 Section: A 2013 Section: A
Anna Nicolaou
Biography Anna Nicolaou is Professor of Biological Chemistry at the Faculty of Medical and Human Sciences, The University of Manchester. Prof Nicolaou received her PhD in bioorganic chemistry from the University of Athens and trained as postdoctoral fellow at the University of London. She then jo...
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